MPC948FA ON Semiconductor, MPC948FA Datasheet - Page 5

• Manufacturer Part Number: MPC948FA
• Manufacturer: ON Semiconductor

Specifications of MPC948FA

• Lead Free Status / Rohs Status: Not Compliant

TIMING SOLUTIONS
BR1333 — Rev 6
SEATING
PLANE
9
B
C
–AB–
–AC–
B1
E
–T–
H
8
1
8X
M _
32
W
DETAIL AD
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
X
–Z–
25
K
R
4X
17
4X
Q _
0.20 (0.008)
OUTLINE DIMENSIONS
–U–
0.20 (0.008)
V1
DETAIL AD
TQFP PACKAGE
CASE 873A–02
V
FA SUFFIX
ISSUE A
AB
AC
T–U
SECTION AE–AE
5
F
É É É É
É É É É
T–U
METAL
BASE
Z
N
J
Z
D
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
9. EXACT SHAPE OF EACH CORNER MAY VARY
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –AB–.
SEATING PLANE –AC–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
0.0076 (0.0003).
FROM DEPICTION.
DIM
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
V
X
F
J
1.400
0.300
1.350
0.300
0.050
0.090
0.500
0.090
0.150
MILLIMETERS
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
DETAIL Y
1
12 REF
_
_
1.600
0.450
1.450
0.400
0.150
0.200
0.700
0.160
0.250
MAX
5
_
0.055
0.012
0.053
0.012
0.002
0.004
0.020
0.004
0.006
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
1
12 REF
INCHES
_
AE
AE
_
0.063
0.018
0.057
0.016
0.006
0.008
0.028
0.006
0.010
MAX
5
_
MPC948
MOTOROLA