LH28F400SUHT-LC15 Sharp Electronics, LH28F400SUHT-LC15 Datasheet

no-image

LH28F400SUHT-LC15

Manufacturer Part Number
LH28F400SUHT-LC15
Description
Manufacturer
Sharp Electronics
Datasheet

Specifications of LH28F400SUHT-LC15

Cell Type
NOR
Density
4Mb
Access Time (max)
150ns
Interface Type
Parallel
Address Bus
19/18Bit
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
0C to 70C
Package Type
TSOP-I
Program/erase Volt (typ)
4.5 to 5.5V
Sync/async
Asynchronous
Operating Temperature Classification
Commercial
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
512K/256K
Supply Current
35mA
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant
LH28F400SU-LC
FEATURES
User-Configurable x8 or x16 Operation
5 V Write/Erase Operation
(5 V V
– No Requirement for DC/DC Converter
150 ns Maximum Access Time
(V
Minimum 2.7 V Read Capability
– 190 ns Maximum Access Time
32 Independently Lockable Blocks (16K)
100,000 Erase Cycles per Block
Automated Byte Write/Block Erase
– Command User Interface
– Status Register
– RY
System Performance Enhancement
– Erase Suspend for Read
– Two-Byte Write
– Full Chip Erase
Data Protection - Hardware Erase/Write
Lockout during Power Transitions
– Software Erase/Write Lockout
Independently Lockable for Write/Erase
on Each Block (Lock Block and Protect
Set/Reset)
4 µA (Typ.) I
0.2 µA (Typ.) Deep Power-Down
Extended Temperature Operation
– -40°C to +85°C
State-of-the-Art 0.55 µm ETOX™ Flash
Technology
56-Pin, 1.2 mm × 14 mm × 20 mm TSOP
(Type I) Package
48-Pin 1.2 mm × 12 mm × 18 mm TSOP
(Type I) Package
44-Pin 600-mil SOP Package
to Write/Erase
CC
(V
CC
    »
/ BY
= 3.3 V ± 0.3 V)
PP
= 2.7 V)
, 3.3 V V
    »
Status Output
CC
in CMOS Standby
CC
)
56-PIN TSOP
RY/BY
4M (512K × 8, 256K × 16) Flash Memory
V
WE
A
A
A
A
A
A
A
NC
NC
NC
NC
NC
NC
NC
RP
NC
A
A
A
A
A
A
A
A
PP
A
Figure 1. 56-Pin TSOP Configuration
15
14
13
12
11
10
17
9
8
7
6
5
4
3
2
1
10
12
13
14
15
16
17
18
19
20
22
23
24
25
26
27
28
11
21
2
3
4
5
6
7
8
9
1
29
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
28F400SUH-LC15-1
DQ
DQ
DQ
DQ
TOP VIEW
NC
A
BYTE
GND
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
V
V
DQ
DQ
DQ
DQ
QE
GND
CE
A
NC
NC
16
CC
CC
0
3
10
2
9
15
7
14
6
13
5
12
4
11
1
8
0
/A
-1
1

Related parts for LH28F400SUHT-LC15

LH28F400SUHT-LC15 Summary of contents

Page 1

... State-of-the-Art 0.55 µm ETOX™ Flash Technology • 56-Pin, 1.2 mm × × TSOP (Type I) Package • 48-Pin 1.2 mm × × TSOP (Type I) Package • 44-Pin 600-mil SOP Package 4M (512K × 8, 256K × 16) Flash Memory 56-PIN TSOP ...

Page 2

... LH28F400SU-LC 48-PIN TSOP RY/ Figure 2. 48-PIn TSOP Configuration 2 4M (512K × 8, 256K × 16) Flash Memory TOP VIEW 44-PIN SOP RP/BY BYTE 47 46 GND GND GND Figure 3. 44-Pin SOP Configuration 0 28F400SUH-LC15-23 TOP VIEW BYTE 32 GND 28F400SUH-LC15-22 ...

Page 3

... Flash Memory OUTPUT BUFFER OUTPUT MULTIPLEXER INPUT -1,0 17 BUFFER Y-DECODER ADDRESS X-DECODER QUEUE LATCHES ADDRESS COUNTER Figure 4. LH28F004SU-LC Block Diagram OUTPUT INPUT BUFFER BUFFER DATA ID QUEUE REGISTER REGISTERS CSR REGISTER ESRs DATA COMPARATOR Y GATING/SENSING . . . . . . LH28F400SU-LC INPUT BUFFER ...

Page 4

... Deep Power-Down state. All » is high and float. Address then becomes the lowest order address (512K × 8, 256K × 16) Flash Memory » goes low, any current or » » pin is floated. selects between the high 1 1 input ...

Page 5

... Flash Memory INTRODUCTION Sharp’s LH28F400SU-LC 4M Flash Memory is a revolutionary architecture which enables the design of truly mobile, high performance, personal computing and communication products. With innovative capabilities, 3.3 V low power operation and very high read/write per- formance, the LH28F400SU-LC is also the ideal choice for designing embedded mass storage flash memory systems ...

Page 6

... Flash Memory 16KB BLOCK 31 16KB BLOCK 30 16KB BLOCK 29 16KB BLOCK 28 16KB BLOCK 27 16KB BLOCK 26 16KB BLOCK 25 16KB BLOCK 24 ...

Page 7

... Flash Memory BUS OPERATIONS, COMMANDS AND STATUS REGISTER DEFINITIONS Bus Operations for Word-Wide Mode (BY » » MODE RP CE Read Output Disable Standby Deep Power-Down Manufacturer Device Write Bus Operations for Word-Wide Mode (BY MODE RP » CE » Read Output Disable ...

Page 8

... A 1 WDL looks at the WDH. In word-wide (x16) mode Second bus cycle address of Protect Set/Confirm and Protect Reset/Confirm command is 0FFH. Specifically A others are don’t care (512K × 8, 256K × 16) Flash Memory FIRST BUS CYCLE OPER. ADDRESS DATA Write X FFH ...

Page 9

... Flash Memory Compatible Status Register WSMS ESS CSR.7 = WRITE STATE MACHINE STATUS (WSMS Ready 0 = Busy CSR.6 = ERASE-SUSPEND STATUS (ESS Erase Suspended 0 = Erase in Progress/Completed CSR.5 = ERASE STATUS (ES Error in Block Erasure 0 = Successful Block Erase CSR.4 = DATA-WRITE STATUS (DWS Error in Data Write 0 = Data Write Successful CSR ...

Page 10

... DATA WRITE CSR. SUCCESSFUL LOW PP CSR.3 = DETECT 0 CLEAR CSRD RETRY/ERROR RECOVERY Figure 6. Word/Byte Writes with Compatible Status Register 10 4M (512K × 8, 256K × 16) Flash Memory BUS COMMAND OPERATION Write Word/Byte D = 40H or 10H Write Write Read Q = CSRD Toggle update CSRD Standby Check CSR ...

Page 11

... Flash Memory START WRITE 20H WRITE D0H AND BLOCK ADDRESS READ COMPATIBLE STATUS REGISTER NO 0 SUSPEND CSR.7 = ERASE 1 CSR FULL STATUS CHECK IF DESIRED OPERATION COMPLETE CSR FULL STATUS CHECK PROCEDURE READ CSRD (see above) 0 ERASE CSR. SUCCESSFUL ...

Page 12

... READ ARRAY DATA DONE NO READING YES WRITE D0H WRITE FFH ERASE RESUMED READ ARRAY DATA Figure 8. Erase Suspend to Read Array with Compatible Status Register 12 4M (512K × 8, 256K × 16) Flash Memory BUS COMMAND OPERATION Write Erase D = B0H Suspend Read Q = CSRD Toggle update CSRD ...

Page 13

... Flash Memory START READ COMPATIBLE STATUS REGISTER 0 CSR RESET WP READ COMPATIBLE STATUS REGISTER 0 CSR WRITE 77H WRITE D0H AND BLOCK ADDRESS READ COMPATIBLE STATUS REGISTER 0 CSR (NOTE) 1 CSR. LOCK YES ANOTHER BLOCK NO SET WP OPERATION COMPLETE BUS COMMAND ...

Page 14

... Use Set-Write-Protect flowchart. This step re-implements protection to locked blocks. 4. Use Word/Byte-Write or 2-Byte-Write flowchart sequences to write data. 5. Use Block-Lock flowchart to write lock bit if desired. Figure 10. Updating Data in a Locked Block 14 4M (512K × 8, 256K × 16) Flash Memory START RESET WP (NOTE 1) WRITE MORE ...

Page 15

... Flash Memory START READ COMPATIBLE STATUS REGISTER 0 CSR WRITE FBH WRITE DATA/A 10 WRITE DATA/ADDRESS READ COMPATIBLE STATUS REGISTER 0 CSR (NOTE) 1 CSR. ANOTHER YES 2-BYTE WRITE NO OPERATION COMPLETE Figure 11. Two-Byte SerialWrites with Compatible Status Registers (40-pin TSOP) (Apply to LH28F004SU, x8, 40TSOP) ...

Page 16

... CSR. ANOTHER YES 2-BYTE WRITE NO OPERATION COMPLETE Figure 12. Two-Byte Serial Writes with Compatible Status Registers (56-pin TSOP, 44-pin SOP (512K × 8, 256K × 16) Flash Memory BUS COMMAND COMMENTS OPERATION Read Q = CSRD Toggle update CSRD WSM Ready 0 = WSM Busy Write 2-Byte ...

Page 17

... Flash Memory START WRITE A7H WRITE D0H READ COMPATIBLE STATUS REGISTER NO 0 SUSPEND CSR.7 = ERASE 1 CSR FULL STATUS CHECK IF DESIRED OPERATION COMPLETE CSR FULL STATUS CHECK PROCEDURE READ CSRD (see above) 0 ERASE CSR. SUCCESSFUL LOW PP CSR.3 = DETECT ...

Page 18

... WRITE CONFIRM DATA/ADDRESS READ COMPATIBLE STATUS REGISTER 0 CSR (NOTE) 1 CSR. OPERATION COMPLETE 18 4M (512K × 8, 256K × 16) Flash Memory BUS COMMAND OPERATION Read Write Set Write Protect Set Confirm Write Read Read NOTE: If CSR. set command sequence error, should be cleared before further attempts are initiated. ...

Page 19

... Flash Memory START READ COMPATIBLE STATUS REGISTER 0 CSR WRITE 47H WRITE CONFIRM DATA/ADDRESS READ COMPATIBLE STATUS REGISTER 0 CSR (NOTE) 1 CSR. OPERATION COMPLETE BUS COMMAND OPERATION Read Write Reset Write Protect Write Reset Confirm Read Read NOTE: If CSR. set command sequence error, should be cleared before further attempts are initiated ...

Page 20

... Timing Specifications Equivalent Testing Load Circuit V NOTE: 1. Sampled, not 100% tested (512K × 8, 256K × 16) Flash Memory * WARNING: Stressing the device beyond the “Abso- lute Maximum Ratings” may cause permanent dam- age. These are stress ratings only. Operation beyond the “Operating Conditions” is not recommended and extended exposure beyond the “ ...

Page 21

... Flash Memory Timing Nomenclature For 3.3 V systems use 1.5 V cross point definitions. Each timing parameter consists of 5 characters. Some common examples are defined below time (t) from CE     » (E) going low (L) to the outputs (Q) becoming valid (V) CE ...

Page 22

... Write Current CCW Block Erase Current CCE CC V Erase Suspend CC I CCES Current I V Standby Current PPS PP V Deep Power-Down PP I PPD Current 22 4M (512K × 8, 256K × 16) Flash Memory TYP. MIN. MAX. UNITS ±1 µ ±10 µ µA CE BYTE = 0 BYTE = V ...

Page 23

... Flash Memory DC Characteristics (Continued 3.3 V ± 0 0°C to +70° SYMBOL PARAMETER I V Read Current PPR Write Current PPW Erase Current PPE PP V Erase Suspend PP I PPES Current V Input Low Voltage IL V Input High Voltage IH V Output Low Voltage ...

Page 24

... OE     » may be delayed ELQV GLQV 3. Sampled, not 100% tested MIN. MAX. UNITS 150 150 ns 150 ns 750 » » Low 20 ns after the falling edge of CE     » without impact (512K × 8, 256K × 16) Flash Memory NOTE ELQV ...

Page 25

... Flash Memory AC Characteristics - Read Only Operations V = 2.85 V ± 0. 0°C to +70° SYMBOL PARAMETER t Read Cycle Time AVAV » t Address Setup to OE Going Low AVGL t Address to Output Delay AVQV t CE » to Output Delay ELQV » High to Output Delay PHQV » ...

Page 26

... STANDBY V IH ADDRESSES ( ( ( ( HIGH-Z OH DATA (D/ 5 GND ( (512K × 8, 256K × 16) Flash Memory DEVICE AND ADDRESS SELECTION OUTPUTS ENABLED ADDRESSES STABLE t AVAV t AVGL t GLQV t ELQV t GLQX t ELQX t AVQV t PHQV Figure 18. Read Timing Waveforms V CC DATA VALID STANDBY . . . POWER-DOWN . . . . . . t EHQZ . . . t GHQZ . . . ...

Page 27

... Flash Memory V IH ADDRESSES ( ( ( BYTE ( HIGH-Z OH DATA ( HIGH-Z OH DATA ( ADDRESSES STABLE t AVAV t FLEL t AVGL t AVQV t GLQV t ELQV t GLQX t ELQX DATA OUTPUT t AVQV t FLQZ DATA OUTPUT Figure 19. BY     »     » Timing Waveforms LH28F400SU- EHQZ ...

Page 28

... The power supply may start to switch concurrently with RP     » 2. The address access time and RP high to data valid time are shown for 3 Characteristics Read Only Operations also (512K × 8, 256K × 16) Flash Memory 3 PL3V     » Power-Up and RP Reset Waveforms CC MIN ...

Page 29

... Flash Memory AC Characteristics for WE     » - Controlled Command Write Operations V = 3.3 V ± 0 0°C to +70° SYMBOL PARAMETER t Write Cycle Time AVAV t V Set Going High VPWH » Setup to CE » Going Low PHEL » Setup to WE Going Low ...

Page 30

... ADDRESS AND DATA AUTOMATED (DATA-WRITE) OR DATA-WRITE ERASE CONFIRM OR ERASE COMMAND DELAY AVWH t WHAX (NOTE AVWH WHAX t t WHWL WHQV WHDX t DVWH WHRL t VPWH 4M (512K × 8, 256K × 16) Flash Memory READ COMPATIBLE STATUS REGISTER DATA t WHGL t GHWL OUT IN t RHPL (NOTE 4) t QVVL 28F004SU-Z9-19 ...

Page 31

... Flash Memory AC Characteristics for CE     » - Controlled Command Write Operations V = 3.3 V ± 0 0°C to +70° SYMBOL PARAMETER t Write Cycle Time AVAV t RP » Setup to WE Going Low PHWL » Set Going High VPEH PP » Setup to CE ...

Page 32

... ADDRESS AND DATA AUTOMATED (DATA-WRITE) OR DATA-WRITE ERASE CONFIRM OR ERASE COMMAND DELAY AVEH t EHAX (NOTE AVEH EHAX t t EHEL EHQV EHDX t DVEH EHRL t VPEH 4M (512K × 8, 256K × 16) Flash Memory READ COMPATIBLE STATUS REGISTER DATA t EHGL t GHEL OUT IN t RHPL (NOTE 4) t QVVL 28F400SUH-LC15-20 ...

Page 33

... Flash Memory Erase and Word/Byte Write Performance V = 3.3 V ± 0 0°C to +70° SYMBOL PARAMETER 1 t Byte Write Time WHRH 2 Two-Byte Serial Write Time t WHRH 3 t Word Write Time WHRH 4 t 16KB Block Write Time WHRH 5 t 16KB Block Write Time ...

Page 34

... MAXIMUM LIMIT DIMENSIONS IN MM [INCHES] MINIMUM LIMIT 34 4M (512K × 8, 256K × 16) Flash Memory 56 0.50 [0.020] TYP. 0.28 [0.011] 0.12 [0.005] 29 0.13 [0.005] 0.49 [0.019] 0.39 [0.015] ...

Page 35

... Flash Memory 48TSOP (TSOP048-P-1218) 0.50 [0.020] 0.30 [0.012] TYP. 0.10 [0.004 12.20 [0.480] 11.80 [0.465] MAXIMUM LIMIT DIMENSIONS IN MM [INCHES] MINIMUM LIMIT 25 16.60 [0.654] 18.40 [0.724] 16.20 [0.638] 17.60 [0.693] 24 0.15 [0.006] 1.10 [0.043] 0.425 [0.017] 0.90 [0.035] 1 ...

Page 36

... MAXIMUM LIMIT DIMENSIONS IN MM [INCHES] MINIMUM LIMIT ORDERING INFORMATION LH28F400SU H X -LC15 Device Type Package Speed Example: LH28F400SUHT-LC15 (4M (512K x 8) Flash Memory, 150 ns, 56-pin TSOP (512K × 8, 256K × 16) Flash Memory 23 13.40 [0.528] 16.40 [0.646] 13.00 [0.512] 15.60 [0.614] SEE 22 DETAIL ...

Page 37

... Camas, WA 98607, U.S.A. Phone: (360) 834-2500 Telex: 49608472 (SHARPCAM) Facsimile: (360) 834-8903 http://www.sharpmeg.com ©1997 by SHARP Corporation Issued July 1995 EUROPE SHARP Electronics (Europe) GmbH Microelectronics Division Sonninstraße 3 20097 Hamburg, Germany Phone: (49) 40 2376-2286 Telex: 2161867 (HEEG D) Facsimile: (49) 40 2376-2232 LH28F400SU-LC ...

Related keywords