CY62167DV30L-55BVI Cypress Semiconductor Corp, CY62167DV30L-55BVI Datasheet - Page 2
![](/photos/40/56/405637/42848vfbga_sml.jpg)
CY62167DV30L-55BVI
Manufacturer Part Number
CY62167DV30L-55BVI
Description
Manufacturer
Cypress Semiconductor Corp
Datasheet
1.CY62167DV30L-55BVI.pdf
(12 pages)
Specifications of CY62167DV30L-55BVI
Density
16Mb
Access Time (max)
55ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
3V
Address Bus
20b
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Number Of Ports
1
Supply Current
30mA
Operating Supply Voltage (min)
2.2V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Word Size
16b
Number Of Words
1M
Lead Free Status / Rohs Status
Not Compliant
Document #: 38-05328 Rev. *F
Pin Configuration
Product Portfolio
Notes:
CY62167DV30L
CY62167DV30LL
2. NC pins are not connected on the die.
3. DNU pins have to be left floating.
4. The BYTE pin in the 48-TSOPI package has to be tied HIGH to use the device as a 1M × 16 SRAM. The 48-TSOPI package can also be used as a 2M × 8 SRAM
5. Ball H6 for the FBGA package can be used to upgrade to a 32M density.
6. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
by tying the BYTE signal LOW. For 2M × 8 Functionality, please refer to the CY62168DV30 datasheet. In the 2M × 8 configuration, Pin 45 is A20.
Product
[2, 3, 4, 5]
Min.
2.20
V
CC
A15
A14
A13
A12
A11
A10
A9
A8
A19
NC
WE
CE2
DNU
BHE
BLE
A18
A17
A7
A6
A5
A4
A3
A2
A1
Typ.
Range (V)
3.0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
[6]
Max.
3.60
BLE
I/O
V
V
I/O
I/O
I/O
A
SS
CC
1
18
14
15
8
9
48TSOPI (Forward)
BHE
I/O
I/O
I/O
I/O
OE
A
A
2
19
Speed
8
10
11
12
13
(ns)
Top View
45
55
70
45
55
70
FBGA
Top View
DNU
A
A
A
A
A
A
A
3
14
17
12
0
5
9
3
A
A
A
Typ.
A
A
A
A
A
4
15
13
10
1
4
7
16
6
2
f = 1MHz
[6]
CE
I/O
I/O
I/O
I/O
WE
A
A
5
11
2
3
1
4
5
Operating I
1
Max.
DNU
Vcc
Vss
CE
I/O
I/O
I/O
I/O
6
4
0
2
2
6
7
Power Dissipation
B
C
D
E
F
G
H
A
Typ.
CC
18.5
18.5
15
12
15
12
(mA)
CC
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
f = f
[6]
= V
A16
BYTE
Vss
I/O15/A20
I/O7
I/O14
I/O6
I/O13
I/O5
I/O12
I/O4
Vcc
I/O11
I/O3
I/O10
I/O2
I/O9
I/O1
I/O8
I/O0
OE
Vss
CE1
A0
max
CC(typ.)
Max.
37
30
25
30
25
37
, T
CY62167DV30
A
= 25°C.
Standby I
Typ.
2.5
2.5
[6]
MoBL
Page 2 of 12
SB2
Max.
30
22
(µA)
®