CY7C1354A-166AC Cypress Semiconductor Corp, CY7C1354A-166AC Datasheet

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CY7C1354A-166AC

Manufacturer Part Number
CY7C1354A-166AC
Description
Manufacturer
Cypress Semiconductor Corp

Specifications of CY7C1354A-166AC

Density
9Mb
Access Time (max)
3.6ns
Operating Supply Voltage (typ)
3.3V
Package Type
TQFP
Operating Temp Range
0C to 70C
Supply Current
480mA
Operating Supply Voltage (min)
3.14V
Operating Supply Voltage (max)
3.47V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
100
Word Size
36b
Lead Free Status / Rohs Status
Not Compliant
Cypress Semiconductor Corporation
Document #: 38-05161Rev. *E
Features
Functional Description
The CY7C1354A and CY7C1356A SRAMs are designed to
eliminate dead cycles when transitioning from Read to Write
or vice versa. These SRAMs are optimized for 100% bus utili-
zation and achieve Zero Bus Latency (ZBL)/No Bus
Latency (NoBL). They integrate 262,144 × 36 and 524,288
× 18 SRAM cells, respectively, with advanced synchronous
peripheral circuitry and a two-bit counter for internal burst
operation. These employ high-speed, low-power CMOS
designs using advanced triple-layer polysilicon, double-layer
metal technology. Each memory cell consists of four
transistors and two high-valued resistors.
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current Commercial
• Zero Bus Latency™, no dead cycles between Write and
• Fast clock speed: 200, 166, 133, 100 MHz
• Fast access time: 3.2, 3.6, 4.2, 5.0 ns
• Internally synchronized registered outputs eliminate
• Single 3.3V –5% and +5% power supply V
• Separate V
• Single WEN (Read/Write) control pin
• Positive clock-edge triggered, address, data, and
• Interleaved or linear four-word burst capability
• Individual byte Write (BWa–BWd) control (may be tied
• CEN pin to enable clock and suspend operations
• Three chip enables for simple depth expansion
• Automatic power-down feature available using ZZ
• JTAG boundary scan
• Low-profile 119-bump, 14-mm × 22-mm BGA (Ball Grid
Read cycles
the need to control OE
control signal registers for fully pipelined applications
LOW)
mode or CE select
Array), and 100-pin TQFP packages
CCQ
for 3.3V or 2.5V I/O
Commercial
CC
3901 North First Street
256K x 36/512K x 18 Pipelined SRAM
7C1354A-200
560
3.2
30
All synchronous inputs are gated by registers controlled by a
positive-edge-triggered clock input (CLK). The synchronous
inputs include all addresses, all data inputs, depth-expansion
Chip Enables (CE, CE
Clock Enable (CEN), Byte Write Enables (BWa, BWb, BWc,
and BWd), and Read-Write Control (WEN). BWc and BWd
apply to CY7C1354A only.
Address and control signals are applied to the SRAM during
one clock cycle, and two cycles later, its associated data
occurs, either Read or Write.
A clock enable (CEN) pin allows operation of the
CY7C1354A/CY7C1356A to be suspended as long as
necessary. All synchronous inputs are ignored when (CEN) is
HIGH and the internal device registers will hold their previous
values.
There are three chip enable pins (CE, CE
user to deselect the device when desired. If any one of these
three are not active when ADV/LD is LOW, no new memory
operation can be initiated and any burst cycle in progress is
stopped. However, any pending data transfers (Read or Write)
will be completed. The data bus will be in high-impedance
state two cycles after chip is deselected or a Write cycle is
initiated.
The CY7C1354A and CY7C1356A have an on-chip two-bit
burst counter. In the burst mode, the CY7C1354A and
CY7C1356A provide four cycles of data for a single address
presented to the SRAM. The order of the burst sequence is
defined by the MODE input pin. The MODE pin selects
between linear and interleaved burst sequence. The ADV/LD
signal is used to load a new external address (ADV/LD = LOW)
or increment the internal burst counter (ADV/LD = HIGH)
Output Enable (OE), Sleep Enable (ZZ) and burst sequence
select (MODE) are the asynchronous signals. OE can be used
to disable the outputs at any given time. ZZ may be tied to
LOW if it is not used.
Four pins are used to implement JTAG test capabilities. The
JTAG circuitry is used to serially shift data to and from the
device. JTAG inputs use LVTTL/LVCMOS levels to shift data
during this testing mode of operation.
7C1354A-166
7C1356A-166
480
3.6
30
with NoBL™ Architecture
San Jose
7C1354A-133
7C1356A-133
2
, and CE
,
CA 95134
410
4.2
30
3
), Cycle Start Input (ADV/LD),
Revised April 5, 2004
7C1356A-100
2
, CE
CY7C1354A
CY7C1356A
350
5.0
30
3
408-943-2600
) that allow the
Unit
mA
mA
ns

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