MLG1608B47NJT000 TDK Corporation, MLG1608B47NJT000 Datasheet

MLG1608B47NJT000

Manufacturer Part Number

MLG1608B47NJT000

Description

Manufacturer

TDK Corporation

Type

High Frequencyr

Datasheet

1.MLG1608B47NJT000.pdf (4 pages)

Specifications of MLG1608B47NJT000

Inductance

47nH

Technology

Multi-Layer

Impedance

Not RequiredOhm

Tolerance (+ Or -)

Dc Resistance

600mOhm

Case Size (inches)

0603in

Operating Temp Range

-55C to 125C

Test Frequency

100MHz

Dc Current

400mA

Product Diameter (mm)

Not Requiredmm

Product Height (mm)

0.8mm

Product Depth (mm)

0.8mm

Product Length (mm)

1.6mm

Military Standard

Not Required

Failure Rate

Not Required

Lead Free Status / Rohs Status

Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MLG1608B47NJT000

Manufacturer:

TDK

Quantity:

4 550

Company:

Meier Automation Equipment Co., Limited

Part Number:

MLG1608B47NJT000

Manufacturer:

TDK/东电化

Quantity:

20 000

Current page: 1 of 4
Download datasheet (53Kb)

SMD Inductors(Coils)

For High Frequency(Multilayer)

MLG Series MLG1608

FEATURES

• Inductance values are supported from 1 to 1000nH.

• Advanced monolithic structure is formed using a multilayering

• The products contain no lead and also support lead-free

• It is a product conforming to RoHS directive.

APPLICATIONS

For high-frequency applications including mobile phones, high

frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB

and tuners.

SHAPES AND DIMENSIONS

RECOMMENDED PC BOARD PATTERN

RECOMMENDED SOLDERING CONDITION

REFLOW SOLDERING

• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

• Please contact our Sales office when your application are considered the following:

• All specifications are subject to change without notice.

250 to 260˚C

230˚C

180˚C

150˚C

The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)

bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

and sintering process with ceramic and conductive materials for

high-frequency.

soldering.

0.6

0.8

Preheating

60 to 120s

0.3±0.2

1.6±0.15

0.6

Time(s)

Dimensions in mm

Soldering

30 to 60s

10s max.

Natural

cooling

Weight: 4mg

PRODUCT IDENTIFICATION

(1) Series name

(2) Dimensions

(3) Material code

(4) Inductance value

(5) Inductance tolerance

(6) Packaging style

SPECIFICATIONS

Operating temperature range

Storage temperature range

PACKAGING STYLE AND QUANTITIES

Packaging style

Taping

HANDLING AND PRECAUTIONS

• Before soldering, be sure to preheat components.

• After mounting components onto the printed circuit board, do not

• When hand soldering, apply the soldering iron to the printed

MLG 1608 B 2N2 S

(1)

The preheating temperature should be set so that the

temperature difference between the solder temperature and

product temperature does not exceed 150°C.

apply stress through board bending or mishandling.

circuit board only. Temperature of the iron tip should not exceed

300°C. Soldering time should not exceed 3 seconds.

1608

2N2

12N

R10

1R0

(2)

(3) (4)

(5) (6)

–55 to +125°C

006-05 / 20090921 / e521_mlg1608.fm

1.6× 0.8mm (L× W)

2.2nH

12nH

100nH

1000nH

±0.3nH

±0.5nH

±5%

Taping (reel)

Quantity

4000 pieces/reel

Conformity to RoHS Directive

(1/4)

Related parts for MLG1608B47NJT000

MLG1608B47NJT000 Summary of contents

Page 1

SMD Inductors(Coils) For High Frequency(Multilayer) MLG Series MLG1608 FEATURES • Inductance values are supported from 1 to 1000nH. • Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for high-frequency. • The products ...

Page 2

ELECTRICAL CHARACTERISTICS Inductance Inductance Q (nH) tolerance min. 1 ±0.3nH 8 1.2 ±0.3nH 8 1.5 ±0.3nH 8 1.8 ±0.3nH 8 2.2 ±0.3nH 10 2.7 ±0.3nH 10 3.3 ±0.3nH 10 3.9 ±0.3nH 10 4.7 ±0.3nH 10 5.6 ±0.5nH 10 6.8 ±0.5nH ...

Page 3

L, Q vs. FREQUENCY CHARACTERISTICS Inductance(nH)typ. Part No. 500MHz 800MHz MLG1608B1N0ST 1.0 1.0 MLG1608B1N2ST 1.2 1.1 MLG1608B1N5ST 1.5 1.5 MLG1608B1N8ST 1.8 1.8 MLG1608B2N2ST 2.2 2.1 MLG1608B2N7ST 2.6 2.6 MLG1608B3N3ST 3.2 3.2 MLG1608B3N9ST 3.8 3.8 MLG1608B4N7ST 4.6 4.6 MLG1608B5N6DT 5.4 5.5 ...

Page 4

PACKAGING STYLES REEL DIMENSIONS 1.0 2.0±0.5 ø13±0.2 ø21±0.8 ø180±2.0 TAPE DIMENSIONS +0.1 Sprocket hole 1.5 –0.0 1.1max. 1.1±0.2 4.0±0.1 2.0±0.05 160min. Taping 200min. Drawing direction • All specifications are subject to change without notice. +2.0 8.4 –0.0 14.4max. Dimensions in ...

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