GS8322Z18B-200 GSI TECHNOLOGY, GS8322Z18B-200 Datasheet
GS8322Z18B-200
Specifications of GS8322Z18B-200
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GS8322Z18B-200 Summary of contents
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... Curr 235 225 210 200 190 (x36) Curr 315 295 265 255 240 (x72) 1/40 250 MHz–133 MHz 3.3 V I/O 4.0 ns 4.0 ns 7.5 ns 185 mA 215 mA 265 mA 8.5 ns 8.5 ns 155 mA 175 mA 230 mA © 2002, GSI Technology DD ...
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... MCH DDQ CKE DDQ MCL MCH DDQ DDQ LBO TDI Bump BGA— Body—1 mm Bump Pitch 2/ DQP DQP F B DDQ DDQ DDQ DDQ DDQ DDQ DDQ DDQ DDQ DDQ DQP DQP A E DDQ DDQ TDO TCK © 2002, GSI Technology ...
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... Linear Burst Order mode; active low Must Connect High Must Connect High Must Connect Low Write Enable; active low FLXDrive Output Impedance Control Low = Low Impedance [High Drive], High = High Impedance [Low Drive] Clock Enable; active low 3/40 I/Os; active low H © 2002, GSI Technology ...
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... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) Description Scan Test Mode Select Scan Test Data In Scan Test Data Out Scan Test Clock Core power supply I/O and Core Ground Output driver power supply 4/40 © 2002, GSI Technology ...
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... V V DQD DQPD LBO TMS TDI TCK TDO 2 Body—1.27 mm Bump Pitch 5/ DDQ DQPB DQB D DQB DQB E V DQB F DDQ DQB DQB G DQB DQB DDQ DQA DQA K DQA DQA L V DQA M DDQ DQA DQA N DQPA DQA DDQ © 2002, GSI Technology ...
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... GS8322Z18B Pad Out—119-Bump BGA—Top View (Package DDQ DQB DDQ DQB V J DDQ DQB V M DDQ N DQB DDQ Bump BGA— Rev: 1.07 4/2008 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) ...
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... Low = Low Impedance [High Drive], High = High Impedance [Low Drive]) Scan Test Mode Select Scan Test Data In Scan Test Data Out Scan Test Clock Core power supply I/O and Core Ground Output driver power supply 7/ I/Os; active low C D BPR1999.05.18 © 2002, GSI Technology ...
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... GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72( CKE ADV TDI A1 TDO A A TMS A0 TCK A 8/ DQPA C DDQ V NC DQA D DDQ V NC DQA E DDQ V NC DQA F DDQ V NC DQA G DDQ DQA NC J DDQ V DQA NC K DDQ V DQA NC L DDQ V DQA NC M DDQ DDQ © 2002, GSI Technology ...
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... CKE ADV TDI A1 TDO A A TMS A0 TCK A 9/ DQPB C DDQ V DQB DQB D DDQ V DQB DQB E DDQ V DQB DQB F DDQ V DQB DQB G DDQ DQA DQA J DDQ V DQA DQA K DDQ V DQA DQA L DDQ V DQA DQA M DDQ V NC DQPA N DDQ © 2002, GSI Technology ...
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... Linear Burst Order mode; active low Scan Test Mode Select Scan Test Data In Scan Test Data Out Scan Test Clock Must Connect High Core power supply I/O and Core Ground Output driver power supply 10/ I/Os; active low C D © 2002, GSI Technology ...
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... Rev: 1.07 4/2008 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72( and B ) determine which bytes will be written. All or none may be activated. A write C, D 11/ and E ). Deassertion of any one of the Enable © 2002, GSI Technology ...
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... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) External L Next L External L Next L External L None L Next L Next L None L None L None L None L None Current L 12/ High High High High-Z 1,2,3, High High High High High © 2002, GSI Technology Notes 1,10 2 1,2, 1,3, ...
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... and D represent input command codes as indicated in the Synchronous Truth Table. n+1 n+2 ƒ ƒ Next State Pipelined and Flow through Read/Write Control State Diagram 13/40 New Write Burst Write B D n+3 ƒ ƒ © 2002, GSI Technology ...
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... and D represent input command codes as indicated in the Truth Tables. Next State (n+2) n n+1 n+2 ƒ ƒ Intermediate Current State State Pipeline Mode Data I/O State Diagram 14/40 Intermediate R B Data Out W (Q Valid) D n+3 ƒ ƒ Next State © 2002, GSI Technology ...
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... Pipeline and Flow Through Read Write Control State Diagram 15/ Data Out W (Q Valid) D Notes 1. The Hold command (CKE Low) is not shown because it prevents any state change and D represent input command codes as indicated in the Truth Tables. n+2 n+3 ƒ ƒ © 2002, GSI Technology ...
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... High Drive (Low Impedance Low Drive (High Impedance) Interleaved Burst Sequence 10 11 1st address 11 00 2nd address 00 01 3rd address 01 10 4th address Note: The burst counter wraps to initial state on the 5th clock. 16/ Table 2: A[1:0] A[1:0] A[1:0] A[1: © 2002, GSI Technology BPR 1999.05.18 ...
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... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) Sleep Mode Timing Diagram tKH tKH tKL tKL tZZS tZZH pipelined parts and V DD DDQ 17/40 2. The duration of SB tZZR on flow through parts. GSI NBT SS © 2002, GSI Technology ...
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... Value –0.5 to 4.6 –0.5 to 4.6 –0 +0.5 (≤ 4.6 V max.) DDQ –0 +0.5 (≤ 4.6 V max.) DD +/–20 +/–20 1.5 –55 to 125 –55 to 125 Typ. Max. Unit 3.3 3.6 V 2.5 2.7 V 3.3 3.6 V 2.5 2.7 V © 2002, GSI Technology Unit Notes ...
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... V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. DDn 19/40 Max. Unit Notes 0.3 V 1,3 DDQ 0.8 V 1,3 Max. Unit Notes 0.3 0.3 V 1,3 DDQ 0.3*V V 1,3 DD Max. Unit Notes ° ° © 2002, GSI Technology ...
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... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) Overshoot Measurement and Timing Symbol Test conditions I/O OUT Conditions V – DDQ V /2 DDQ Fig. 1 Output Load 1 50Ω 30pF V DDQ/2 * Distributed Test Jig Capacitance 20/40 20% tKC DD IL Typ. Max. Unit © 2002, GSI Technology ...
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... OUT I Output Disable OUT –8 mA, V OH2 OH DDQ –8 mA, V OH3 OH DDQ 21/40 Min – ≥ V – ≤ V –1 uA 100 uA IH ≥ V –100 uA IL ≤ V – – – 2.375 V 1 3.135 V 2.4 V — © 2002, GSI Technology Max — — 0.4 V ...
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... Rev: 1.07 4/2008 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) 22/40 © 2002, GSI Technology ...
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... GSI Technology -133 Unit Min Max 7.5 — ns 4.0 ns — 4.0 ns — 1.5 — ns 1.5 ns — 1.5 — ns 0.5 ns — 8.5 — ...
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... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) Suspend Read C Write D writeno-op tKH tKH tKC tKC tKL tKL D(A) Q(B) Q(C) 24/40 Read E Deselect E tLZ tHZ tKQ tKQX D(D) Q(E) © 2002, GSI Technology ...
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... Flow Through Mode Timing (NBT) Write B+1 Read C Cont tKL tKL tKH tKH tKC tKC C D tKQ tLZ D(B) D(B+1) Q(C) tOHZ 25/40 Read D Write E Read F Write tKQ tKQX tHZ tLZ Q(D) D(E) Q(F) tOLZ tOE . The JTAG output DD © 2002, GSI Technology tKQX D(G) ...
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... Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z, SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register. Rev: 1.07 4/2008 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72( TDO should be left unconnected Description 26/40 © 2002, GSI Technology ...
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... GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) JTAG TAP Block Diagram · · · · · · Boundary Scan Register 0 Bypass Register Instruction Register ID Code Register · · · · Control Signals Test Access Port (TAP) Controller 27/40 · · TDO © 2002, GSI Technology ...
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... TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this device is listed in the following table. Rev: 1.07 4/2008 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) Not Used Configuration 28/40 GSI Technology I/O JEDEC Vendor ID Code © 2002, GSI Technology ...
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... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) JTAG Tap Controller State Diagram 1 1 Select Capture DR 0 Shift Exit1 DR 0 Pause Exit2 Update 29/40 1 Select Capture IR 0 Shift Exit1 IR 0 Pause Exit2 Update © 2002, GSI Technology ...
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... Instruction codes expressed in binary, MSB on left, LSB on right. 2. Default instruction automatically loaded at power-up and in test-logic-reset state. Rev: 1.07 4/2008 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) Description 30/40 Notes © 2002, GSI Technology ...
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... V –0.3 0 +0.3 V DD2 DD2 0 –0.3 V DD2 –300 1 uA –1 100 uA – 1.7 — V 0.4 V — – 100 mV V — DDQ 100 mV V — JTAG Port AC Test Load DQ 50Ω 30pF V /2 DDQ * Distributed Test Jig Capacitance © 2002, GSI Technology ...
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... Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) JTAG Port Timing Diagram tTKC tTKC tTKH tTKH tTH tTS tTH tTS tTKQ tTH tTS Min Max Unit 50 — ns — — ns — — ns — 32/40 tTKL tTKL © 2002, GSI Technology ...
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... Rev 1.0 Rev: 1.07 4/2008 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72( ∅b e Max Units 1.70 mm 0.60 mm 0.70 mm 0. 33/ Side View Bottom View © 2002, GSI Technology ...
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... Package Dimensions—119-Bump FPBGA (Package GB (MCM), Variation 2 TOP VIEW SEATING PLANE C Rev: 1.07 4/2008 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) BOTTOM VIEW A1 Ø0. Ø0. Ø0.60~0.90 (119x 7.62 14±0.10 A 0.20(4x) 34/ 1.27 © 2002, GSI Technology ...
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... Package Dimensions—165-Bump FPBGA (Package E) A1 TOP SEATING C Rev: 1.07 4/2008 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C) BOTTOM Ø0. Ø0. Ø0.40~0. 1.0 10. 15±0.0 B 0.20(4 35/ 1.0 BPR 1999.05.18 © 2002, GSI Technology ...
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... Ordering Information for GSI Synchronous Burst RAMs 1 Org Part Number GS8322Z18B-250 GS8322Z18B-225 GS8322Z18B-200 GS8322Z18B-166 GS8322Z18B-150 GS8322Z18B-133 GS8322Z18E-250 GS8322Z18E-225 GS8322Z18E-200 GS8322Z18E-166 GS8322Z18E-150 GS8322Z18E-133 GS8322Z36B-250 GS8322Z36B-225 GS8322Z36B-200 GS8322Z36B-166 GS8322Z36B-150 GS8322Z36B-133 GS8322Z36E-250 GS8322Z36E-225 GS8322Z36E-200 GS8322Z36E-166 GS8322Z36E-150 GS8322Z36E-133 512K x 72 GS8322Z72C-250 512K x 72 GS8322Z72C-225 512K x 72 ...
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... Ordering Information for GSI Synchronous Burst RAMs (Cont.) 1 Org Part Number GS8322Z18B-250I GS8322Z18B-225I GS8322Z18B-200I GS8322Z18B-166I GS8322Z18B-150I GS8322Z18B-133I GS8322Z18E-250I GS8322Z18E-225I GS8322Z18E-200I GS8322Z18E-166I GS8322Z18E-150I GS8322Z18E-133I GS8322Z36B-250I GS8322Z36B-225I GS8322Z36B-200I GS8322Z36B-166I GS8322Z36B-150I GS8322Z36B-133I GS8322Z36E-250I GS8322Z36E-225I GS8322Z36E-200I GS8322Z36E-166I GS8322Z36E-150I GS8322Z36E-133I 512K x 72 GS8322Z72C-250I 512K x 72 GS8322Z72C-225I ...
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... GS8322Z18GB-225I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8322Z18B-150IB. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user ...
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... GS8322Z72GC-133I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8322Z18B-150IB. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user ...
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... Added variation information to package mechanicals • Pb-free information added Content • Corrected AC Electrical Characteristics Table Content • Rev1.06a: updated coplanarity for 119, 165 BGA mechanical, removed Status column from Ordering Information table. • Updated Synchronous Truth Table (pg. 12) Content 40/40 © 2002, GSI Technology ...