74ALVCH16244DGG NXP Semiconductors, 74ALVCH16244DGG Datasheet - Page 15

• Manufacturer Part Number: 74ALVCH16244DGG
• Manufacturer: NXP Semiconductors

Specifications of 74ALVCH16244DGG

• Logic Family: ALVC
• Logical Function: Buffer/Line Driver
• Number Of Elements: 4
• Number Of Channels: 16
• Number Of Inputs: 16
• Number Of Outputs: 16
• Operating Supply Voltage (typ): 1.8/2.5/3.3V
• Package Type: TSSOP
• Output Type: 3-State
• Polarity: Non-Inverting
• Propagation Delay Time: 7.1ns
• High Level Output Current: -24mA
• Low Level Output Current: 24mA
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.2V
• Quiescent Current: 40uA
• Technology: CMOS
• Pin Count: 48
• Mounting: Surface Mount
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
2003 May 14
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
2.5 V/3.3 V 16-bit buffer/line driver
(3-state)
from your Philips Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(4)
, SO, SOJ
PACKAGE
(1)
15
not suitable
not suitable
suitable
not recommended
not recommended
WAVE
(3)
SOLDERING METHOD
(4)(5)
(6)
74ALVCH16244
74ALVC16244;
suitable
suitable
suitable
suitable
suitable
Product specification
REFLOW
(2)