W24257-70LL Winbond Electronics, W24257-70LL Datasheet - Page 8

• Manufacturer Part Number: W24257-70LL
• Manufacturer: Winbond Electronics

Specifications of W24257-70LL

• Lead Free Status / Rohs Status: Not Compliant

BONDING PAD DIAGRAM
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to V
A3
A2
7
8
A4
6
A1
9
A5
5
A0 I/O0 I/O1 I/O2 V
10
A6
4
11
A7
3
12
Y
A12
2
13
A14
1
14
SS
V
30
DD
V
15
SS
V
29
X
I/O3
DD
16
WEB
I/O4 I/O5 I/O6
17
28
A13
18
27
19
26
A8
AC5394
I/O7
20
A9
25
A11
CSB
24
21
OEB
23
A10
22
- 8 -
PAD NO.
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
1
2
3
4
5
6
7
8
9
Publication Release Date: January 2001
DD
or left floating in the PCB layout.
-232.25
-351.70
-471.15
-590.60
-710.05
-829.50
-992.79
-992.79
-857.86
-738.41
-594.84
-451.06
-310.67
-171.78
151.80
298.07
443.28
588.20
732.84
871.11
992.75
992.75
810.09
690.64
571.19
451.74
332.29
120.25
-93.23
X
24.45
W24257
-1306.11
-1452.79
-1452.79
-1414.13
-1414.13
-1414.13
-1405.28
-1405.28
-1414.13
-1414.13
-1414.13
-1414.13
-1414.13
-1452.79
-1312.15
Revision A16
1445.22
1445.22
1445.22
1445.22
1445.22
1445.22
1362.24
1373.67
1445.22
1445.22
1445.22
1445.22
1445.22
1444.65
1444.65
Y