TE28F160C3BA90 Micron Technology Inc, TE28F160C3BA90 Datasheet - Page 69

• Manufacturer Part Number: TE28F160C3BA90
• Manufacturer: Micron Technology Inc

Specifications of TE28F160C3BA90

• Density: 16Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 20b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 1M
• Supply Current: 18mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

C3 Discrete
Appendix E Ordering Information
Figure 23: Component Ordering Information
March 2008
290645-24
Package
TE = 48- Lead TSOP
GT = 48- Ball µBGA * CSP
GE = VF BGA CSP
RC = Easy BGA
PC = Pb Free Easy BGA
PH = Pb Free VFBGA
JS = Pb Free TSOP
Device Density
640 = x16 (64 Mbit)
320 = x16 (32 Mbit)
160 = x16 (16 Mbit)
800 = x16 (8 Mbit)
Product line designator
for all Intel
®
Flash products
T E 2 8 F 3 2 0 C 3 T C 7 0
Access Speed (ns)
(70, 80 , 90, 100 , 110 )
T = Top Blocking
B = Bottom Blocking
Product Family
C3 = 3 Volt Advanced+ Boot Block
V
V
CC
PP
Lithography
A = 0.25 µm
C = 0.18 µm
D = 0.13 µm
= 2 .7 V–3 .6 V or
= 2.7 V–3.6 V
11 . 4 V–12 .6 V
Datasheet
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