TE28F160C3BA110 Micron Technology Inc, TE28F160C3BA110 Datasheet - Page 8
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TE28F160C3BA110
Manufacturer Part Number
TE28F160C3BA110
Description
Manufacturer
Micron Technology Inc
Datasheet
1.TE28F160C3BA110.pdf
(70 pages)
Specifications of TE28F160C3BA110
Density
16Mb
Access Time (max)
110ns
Interface Type
Parallel
Boot Type
Bottom
Address Bus
20b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
1M
Supply Current
18mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TE28F160C3BA110
Manufacturer:
INTEL
Quantity:
1 400
Company:
Part Number:
TE28F160C3BA110
Manufacturer:
FSC
Quantity:
3
1.2
Datasheet
8
Conventions
The terms pin and signal are often used interchangeably to refer to the external signal
connections on the package; for chip scale package (CSP) the term ball is used.
Group Membership Brackets: Square brackets will be used to designate group
membership or to define a group of signals with similar function (i.e. A[21:1], SR[4:1])
Set: When referring to registers, the term set means the bit is a logical 1.
Clear: When referring to registers, the term clear means the bit is a logical 0.
Block: A group of bits (or words) that erase simultaneously with one block erase
instruction.
Main Block: A block that contains 32 Kwords.
Parameter Block: A block that contains 4 Kwords.
C3 Discrete
March 2008
290645-24