LP3965EMPX-ADJ National Semiconductor, LP3965EMPX-ADJ Datasheet - Page 16
![LDO Regulator Pos 1.216V to 5.1V 1.5A 5-Pin(4+Tab) SOT-223 T/R](/photos/40/57/405700/5pin_sot-223_sml.jpg)
LP3965EMPX-ADJ
Manufacturer Part Number
LP3965EMPX-ADJ
Description
LDO Regulator Pos 1.216V to 5.1V 1.5A 5-Pin(4+Tab) SOT-223 T/R
Manufacturer
National Semiconductor
Type
Linearr
Datasheet
1.LP3965EMPX-ADJ.pdf
(22 pages)
Specifications of LP3965EMPX-ADJ
Voltage Regulator Type
Linear
Topology
LDO
Regulator Output Type
Adjustable
Polarity Type
Positive
Number Of Outputs
Single
Input Voltage (min)
2.5V
Input Voltage (max)
7V
Output Voltage
1.216 to 5.1V
Package Type
SOT-223
Output Current
1.5A
Load Regulation
0.04%
Line Regulation
0.02%
Output Voltage Accuracy
±1.5%
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Pin Count
4 +Tab
Mounting
Surface Mount
Package
5SOT-223
Function
LDO
Input Voltage Range
7 to 2.5 V
Maximum Output Current
1.5 A
Output Type
Adjustable
Accuracy
±1.5 %
Typical Dropout Voltage @ Current
0.038@150mA|0.38@1500mA V
Operating Temperature
-40 to 125 °C
Polarity
Positive
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LP3965EMPX-ADJ
Manufacturer:
NS/国半
Quantity:
20 000
www.national.com
Applications Information
HEATSINKING TO-263 AND SOT-223 PACKAGES
The TO-263 and SOT223 packages use the copper plane on
the PCB as a heatsink. The tab of these packages are
soldered to the copper plane for heat sinking. Figure 3
shows a curve for the θ
copper area sizes, using a typical PCB with 1 ounce copper
and no solder mask over the copper area for heat sinking.
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. The minimum
value for θ
32˚C/W.
Figure 4 shows the maximum allowable power dissipation
for TO-263 packages for different ambient temperatures,
assuming θ
ture is 125˚C.
Figure 5 shows a curve for the θ
different copper area sizes, using a typical PCB with 1 ounce
copper and no solder mask over the copper area for heat
sinking.
FIGURE 3. θ
FIGURE 4. Maximum power dissipation vs ambient
JA
JA
temperature for TO-263 package
for the TO-263 packag mounted to a PCB is
is 35˚C/W and the maximum junction tempera-
JA
vs Copper(1 Ounce) Area for TO-263
JA
package
of TO-263 package for different
JA
of SOT-223 package for
(Continued)
10126632
10126633
16
The following figures show different layout scenarios for
SOT-223 package.
FIGURE 5. θ
FIGURE 6. SCENARIO A, θ
FIGURE 7. SCENARIO B, θ
JA
vs Copper(1 Ounce) Area for SOT-223
package
JA
JA
= 148˚C/W
= 125˚C/W
10126619
10126621
10126620