ISL9N306AS3ST Fairchild Semiconductor, ISL9N306AS3ST Datasheet
ISL9N306AS3ST
Specifications of ISL9N306AS3ST
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ISL9N306AS3ST Summary of contents
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... Thermal Resistance Junction to Case TO-220, TO-263 JC R Thermal Resistance Junction to Ambient TO-220, TO-263 JA R Thermal Resistance Junction to Ambient TO-263, 1in JA Package Marking and Ordering Information Device Marking Device N306AS ISL9N306AS3ST N306AP ISL9N306AP3 ©2002 Fairchild Semiconductor Corporation Features • Fast switching • 0.0052 DS(ON) • 0.0085 DS(ON) • ...
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... Fall Time f t Turn-Off Time OFF Unclamped Inductive Switching t Avalanche Time AV Drain-Source Diode Characteristics V Source to Drain Diode Voltage SD t Reverse Recovery Time rr Q Reverse Recovered Charge RR ©2002 Fairchild Semiconductor Corporation T = 25°C unless otherwise noted A Test Conditions I = 250 25V 20V GS ...
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... SINGLE PULSE 0. Figure 3. Normalized Maximum Transient Thermal Impedance 2000 1000 V = 10V 100 TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION ©2002 Fairchild Semiconductor Corporation 150 175 125 Figure 2. Maximum Continuous Drain Current RECTANGULAR PULSE DURATION ( PULSE WIDTH (s) Figure 4. Peak Current Capability ...
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... GATE TO SOURCE VOLTAGE (V) GS Figure 7. Drain to Source On Resistance vs Gate Voltage and Drain Current 1.4 1.0 0.6 0.2 -80 - JUNCTION TEMPERATURE ( J Figure 9. Normalized Gate Threshold Voltage vs Junction Temperature ©2002 Fairchild Semiconductor Corporation (Continued) 150 T 100 - Figure 6. Saturation Characteristics 2 1.5 1.0 0.5 - Figure 8. Normalized Drain to Source On Resistance vs Junction Temperature 1 ...
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... R , GATE TO SOURCE RESISTANCE ( ) GS Figure 13. Switching Time vs Gate Resistance Test Circuits and Waveforms VARY t TO OBTAIN P R REQUIRED PEAK Figure 15. Unclamped Energy Test Circuit ©2002 Fairchild Semiconductor Corporation (Continued OSS Figure 12. Gate Charge Waveforms for Constant 500 400 t 300 f 200 ...
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... Test Circuits and Waveforms g(REF) Figure 17. Gate Charge Test Circuit Figure 19. Switching Time Test Circuit ©2002 Fairchild Semiconductor Corporation (Continued DUT g(REF) 0 Figure 18. Gate Charge Waveforms d(ON 90 DUT V GS 50% 10% 0 Figure 20. Switching Time Waveforms Q g(TOT g( g(TH OFF t d(OFF 10% 10% 90% 50% PULSE WIDTH Rev ...
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... JA times a coefficient added to a constant. The area, in square inches is the top copper area including the gate and source pads. 19.84 26.51 + ------------------------------------ - 0.262 + A rea ©2002 Fairchild Semiconductor Corporation , and the application’s ambient never exceeded (EQ ...
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... S2BMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = 0.2 VOFF= -0.3) .ENDS NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley. ©2002 Fairchild Semiconductor Corporation DPLCAP 5 10 RSLC1 ...
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... Fairchild Semiconductor Corporation DPLCAP 10 RSLC2 - 6 ESG 8 EVTHRES + ...
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... Fairchild Semiconductor Corporation JUNCTION th RTHERM1 CTHERM1 6 RTHERM2 CTHERM2 5 RTHERM3 CTHERM3 4 RTHERM4 CTHERM4 3 RTHERM5 ...
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... TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. ACEx™ FAST Bottomless™ FASTr™ FRFET™ CoolFET™ GlobalOptoisolator™ CROSSVOLT™ GTO™ DenseTrench™ ...