MT48LC8M16LFB4-8 Micron Technology Inc, MT48LC8M16LFB4-8 Datasheet - Page 77

• Manufacturer Part Number: MT48LC8M16LFB4-8
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48LC8M16LFB4-8

• Organization: 8Mx16
• Density: 128Mb
• Address Bus: 14b
• Access Time (max): 19/8/7ns
• Maximum Clock Rate: 125MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 100mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Package Dimensions
Figure 57:
PDF: 09005aef807f4885/Source: 09005aef8071a76b
128Mbx16x32Mobile_2.fm - Rev. L 10/07 EN
54X Ø0.45 ±0.05
SEATING PLANE
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS 0.42.
6.40
54-Ball FBGA, “F4/B4” Package (x16 Device), 8mm x 8mm
0.10 C
BALL A9
3.20
Notes:
0.65 ±0.05
C
1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.40mm.
3. Topside part marking decoder can be found at http://www.micron.com/support/fbga/
decoder.aspx.
3.20
8.00 ±0.10
6.40
C L
0.80
TYP
4.00 ±0.05
0.80 TYP
C L
BALL A1
BALL A1 ID
77
4.00 ±0.05
8.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
128Mb: x16, x32 Mobile SDRAM
SOLDER BALL MATERIAL:
SOLDER MASK DEFINED BALL PADS:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
Ø0.40
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
BALL A1 ID