LM4868LQX National Semiconductor, LM4868LQX Datasheet
LM4868LQX
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LM4868LQX Summary of contents
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... Note 2: An LM4868LQ or LM4868MTE that has been properly mounted to a circuit board and forced-air cooled will deliver 2.4W into 3Ω. Connection Diagrams See NS Package Number MXA20A for Exposed-DAP TSSOP Boomer ® registered trademark of National Semiconductor Corporation. © 2002 National Semiconductor Corporation Key Specifications THD+N O LM4868LQ, 3Ω ...
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Connection Diagrams See NS Package Number LQA24A for Exposed-DAP LLP Typical Application * Refer to the Application Information section titled PROPER SELECTION OF EXTERNAL COMPONENTS for details concerning the value of C FIGURE 1. Typical Audio Amplifier Application Circuit (Pin ...
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... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Storage Temperature Input Voltage Power Dissipation (Note 4) ESD Susceptibility (Note 5) All pins except Pin 3 (MT, MTE), Pin 2 (LQ) Pin 3 (MT, MTE), Pin 2 (LQ) ...
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Electrical Characteristics for Bridged-Mode Operation The following specifications apply for V Symbol Parameter THD+N Total Harmonic Distortion+Noise PSRR Power Supply Rejection Ratio X Channel Separation TALK SNR Signal To Noise Ratio Electrical Characteristics for Single-Ended Operation The following specifications apply ...
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Typical Performance Characteristics MTE- and LQ- Specific Characteristics LM4868MTE THD+N vs Output Power LM4868LQ THD+N vs Output Power LM4868MTE THD+N vs Output Power 20026733 20026753 20026736 5 LM4868MTE THD+N vs Frequency 20026734 LM4868LQ THD+N vs Frequency 20026754 LM4868LQ THD+N vs ...
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Typical Performance Characteristics MTE- and LQ- Specific Characteristics LM4868LQ, LM4868MTE Power Dissipation vs Power Output LM4868LQ Power Derating Curve Note 18: This curve shows the LM4868MTE’s thermal dissipation ability at different ambient temperatures given these conditions: 500LFPM + JEDEC board: ...
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Typical Performance Characteristics THD+N vs Frequency THD+N vs Frequency THD+N vs Output Power 20026703 THD+N vs Output Power 20026705 THD+N vs Output Power 20026707 7 THD+N vs Frequency 20026704 20026706 20026708 www.national.com ...
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Typical Performance Characteristics THD+N vs Output Power THD+N vs Output Power Output Power vs Load Resistance www.national.com (Continued) 20026765 20026766 20026762 8 THD+N vs Frequency 20026763 THD+N vs Frequency 20026764 Power Dissipation vs Supply Voltage 20026760 ...
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Typical Performance Characteristics Output Power vs Supply Voltage Output Power vs Supply Voltage Output Power vs Load Resistance (Continued) 20026709 20026711 20026713 9 Output Power vs Supply Voltage 20026710 Output Power vs Load Resistance 20026712 Power Dissipation vs Output Power ...
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Typical Performance Characteristics Dropout Voltage vs Supply Voltage Power Dissipation vs Output Power Channel Separation www.national.com (Continued) 20026715 20026717 20026719 10 Power Derating Curve 20026716 Noise Floor 20026718 Channel Separation 20026720 ...
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Typical Performance Characteristics Power Supply Rejection Ratio Supply Current vs Supply Voltage ( Refer to Figure 1. ) Components 1. R This is the inverting input resistance that sets the closed-loop gain in conjunction with R i forms a high ...
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Application Information headphones. The headphones operate in a manner very similar to a bridge-tied-load (BTL). The same DC voltage is applied to both headphone speaker terminals. This results in no net DC current flow through the speaker. AC current flows ...
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Application Information FIGURE 4. Typical Audio Amplifier Application Circuit (Pin out shown for the 24-pin Exposed-DAP LLP package. Numbers are for the 20-pin MTE and MT packages.) FIGURE 5. Input MUX Example STEREO-INPUT MULTIPLEXER (STEREO MUX) The ...
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Application Information present on the internal amplifier’s input may change. This change can slew at a rate that may produce audible voltage transients or clicks in the amplifier’s output signal. Using the MUX to select between two vastly dissimilar gains ...
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Application Information tical in magnitude, but 180˚ out of phase. Taking advantage of this phase difference, a load is placed between -OUTA and +OUTA and driven differentially (’commonly referred to as bridge mode’). This results in a differential gain of ...
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Application Information pop performance. The selection of bypass capacitor values, especially C , depends on desired PSRR requirements, B click and pop performance (as explained in the section, Proper Selection of External Components), system cost, and size constraints. MICRO−POWER SHUTDOWN ...
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Application Information FIGURE 7. The PCDN042 provides additional ESD protection beyond the 8000V shown in the Absolute Maximum Ratings for the AMP2A output Single-Ended Output Power Performance and Measurement Considerations The LM4868 delivers clean, low distortion SE output power into ...
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Application Information V ), the smaller the turn-on pop. Choosing C DD 1.0µF along with a small value 0.39µF), produces a click-less and pop-less shutdown func- tion. As discussed above, choosing C sary for the desired bandwidth ...
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Application Information f = 100Hz/5 = 20Hz L and 20kHz 100kHz H As mentioned in the Selecting Proper External Compo- nents section, R and C create a highpass filter that sets the i i ...
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Application Information www.national.com (Continued) FIGURE 10. Recommended LQ PC Board Layout: Component-Side Layout FIGURE 11. Recommended LQ PC Board Layout: Upper Inner-Layer Layout 20 20026741 20026742 ...
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Application Information FIGURE 12. Recommended LQ PC Board Layout: FIGURE 13. Recommended LQ PC Board Layout: (Continued) Lower Inner-Layer Layout Bottom-Side Layout 21 20026743 20026744 www.national.com ...
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Application Information www.national.com (Continued) FIGURE 14. Recommended MTE PC Board Layout: Component-Side Silkscreen FIGURE 15. Recommended MTE PC Board Layout: Component-Side Layout 22 20026770 20026771 ...
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Application Information FIGURE 16. Recommended MTE PC Board Layout: FIGURE 17. Recommended MTE PC Board Layout: (Continued) Upper Inner-Layer Layout Lower Inner-Layer Layout 23 20026772 20026773 www.national.com ...
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Application Information www.national.com (Continued) FIGURE 18. Recommended MTE PC Board Layout: Bottom-Side Layout FIGURE 19. Recommended MT PC Board Layout: Component-Side Silkscreen 24 20026774 20026775 ...
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Application Information FIGURE 20. Recommended MT PC Board Layout: FIGURE 21. Recommended MT PC Board Layout: (Continued) Component-Side Layout Bottom-Side Layout 25 20026776 20026777 www.national.com ...
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Physical Dimensions 24-Lead MOLDED PKG, Leadless Leadframe Package LLP 20-Lead MOLDED PKG, TSSOP, JEDEC, 4.4mm BODY WIDTH www.national.com inches (millimeters) unless otherwise noted Order Number LM4868LQ NS Package Number LQA24A Order Number LM4868MT NS Package Number MTC20 26 ...
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead MOLDED TSSOP, EXPOSED PAD, 6.5x4.4x0.9mm Order Number LM4868MTE NS Package Number MXA20A 27 www.national.com ...
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... NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant ...