MC10ELT22DR2 ON Semiconductor, MC10ELT22DR2 Datasheet
MC10ELT22DR2
Specifications of MC10ELT22DR2
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MC10ELT22DR2 Summary of contents
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MC10ELT22, MC100ELT22 5.0 V Dual TTL to Differential PECL Translator The MC10ELT/100ELT22 is a dual TTL to differential PECL translator. Because PECL (Positive ECL) levels are used only +5 V and ground are required. The small outline 8-lead package and ...
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PECL TTL Figure 1. Logic Diagram and Pinout Assignment Table 2. ATTRIBUTES Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) ...
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Table 3. MAXIMUM RATINGS Symbol Parameter V Positive Power Supply CC V Input Voltage IN I Output Current out T Operating Temperature Range A T Storage Temperature Range stg Thermal Resistance (Junction−to−Ambient Thermal Resistance (Junction−to−Case ...
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Table 6. TTL INPUT DC CHARACTERISTICS Symbol Characteristic I Input HIGH Current IH I Input HIGH Current IHH I Input LOW Current IL V Input Clamp Diode Voltage IK V Input HIGH Voltage IH V Input LOW Voltage IL NOTE: ...
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... Q Driver Device Q Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) ORDERING INFORMATION Device MC10ELT22D MC10ELT22DG MC10ELT22DR2 MC10ELT22DR2G MC10ELT22DT MC10ELT22DTG MC10ELT22DTR2 MC10ELT22DTR2G MC100ELT22D MC100ELT22DG MC100ELT22DR2 MC100ELT22DR2G MC100ELT22DT MC100ELT22DTG MC100ELT22DTR2 MC100ELT22DTR2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D ...
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Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ...
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... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...
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... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...