DTC114YE ON Semiconductor, DTC114YE Datasheet - Page 5

• Manufacturer Part Number: DTC114YE
• Manufacturer: ON Semiconductor

Specifications of DTC114YE

• Transistor Polarity: NPN
• Collector-emitter Voltage: 50V
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Package Type: SOT-416
• Lead Free Status / Rohs Status: Not Compliant

control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 9 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can affect
the profile include the type of soldering system in use,
density and types of components on the board, type of solder
used, and the type of board or substrate material being used.
This profile shows temperature versus time. The line on the
For any given circuit board, there will be a group of
200°C
150°C
100°C
50°C
PREHEAT
STEP 1
ZONE 1
TIME (3 TO 7 MINUTES TOTAL)
RAMP"
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
TYPICAL SOLDER HEATING PROFILE
STEP 2
VENT
SOAK"
150°C
100°C
Figure 9. Typical Solder Heating Profile
ZONES 2 & 5
DESIRED CURVE FOR LOW
HEATING
STEP 3
RAMP"
http://onsemi.com
MASS ASSEMBLIES
160°C
5
ZONES 3 & 6
140°C
HEATING
STEP 4
SOAK"
graph shows the actual temperature that might be
experienced on the surface of a test board at or near a central
solder joint. The two profiles are based on a high density and
a
convection/infrared reflow soldering system was used to
generate this profile. The type of solder used was 62/36/2
Tin Lead Silver with a melting point between 177−189°C.
When this type of furnace is used for solder reflow work, the
circuit boards and solder joints tend to heat first. The
components on the board are then heated by conduction. The
circuit board, because it has a large surface area, absorbs the
thermal energy more efficiently, then distributes this energy
to the components. Because of this effect, the main body of
a component may be up to 30 degrees cooler than the
adjacent solder joints.
low
SOLDER IS LIQUID FOR
MASS OF ASSEMBLY)
170°C
40 TO 80 SECONDS
ZONES 4 & 7
(DEPENDING ON
HEATING
density
STEP 5
SPIKE"
T
MAX
board.
STEP 6
VENT
SOLDER JOINT
205° TO 219°C
COOLING
STEP 7
PEAK AT
The
Vitronics
SMD310