AM29F400AT-90SC Spansion Inc., AM29F400AT-90SC Datasheet - Page 10

• Manufacturer Part Number: AM29F400AT-90SC
• Manufacturer: Spansion Inc.

Specifications of AM29F400AT-90SC

• Lead Free Status / Rohs Status: Not Compliant

PHYSICAL SPECIFICATIONS
Die Dimensions . . . . . . . . . . . . . . 135 mils x 198 mils
Die Thickness. . . . . . . . . . . . . . . . . ~500 µm/~20 mils
Bond Pad Size . . . . . . . . . . . . . . 4.69 mils x 4.69 mils
Pad Area Free of Passivation . . . . . . . . . 13.98 mils
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Bond Pad Metallization . . . . . . . . . . . . . . . . . . . Al/Cu
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
Passivation . . . . . . . . . . . . . . . . . . . . . . SiN/SOG/SiN
DC OPERATING CONDITIONS
V
Junction Temperature Under Bias . .T
Operating Temperature
Contact AMD for higher temperature range devices.
8
. . . . . . . . . . . . . . . . . . . . . . . . . . . 3.42 mm x 5.02 mm
. . . . . . . . . . . . . . . . . . . . . . . . . . 115.9 µm x 115.9 µm
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9,025 µm
. . . . . . . . . . . . . . . . . . . . may be grounded (optional)
CC
Commercial . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended . . . . . . . . . . . . . . . . . . –55°C to +125°C
(Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V
J
(max) = 130°C
Am29F400B Known Good Die
S U P P L E M E N T
2
2
MANUFACTURING INFORMATION
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL
Test . . . . . . . . . . . . . . . . . . . . . . Sunnyvale, CA, USA,
Manufacturing ID (Top Boot) . . . . . . . . . . . . 98F02AK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . . CS39S
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30°C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
. . . . . . . . . . . . . . . . . . . . . . . . .and Penang, Malaysia
(Bottom Boot) . . . . . . . 98F02ABK