K6X4008C1F-BF55 Samsung Semiconductor, K6X4008C1F-BF55 Datasheet - Page 9

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K6X4008C1F-BF55

Manufacturer Part Number
K6X4008C1F-BF55
Description
Manufacturer
Samsung Semiconductor
Datasheet

Specifications of K6X4008C1F-BF55

Density
4Mb
Access Time (max)
55ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
5V
Address Bus
19b
Package Type
SOP
Operating Temp Range
-40C to 85C
Number Of Ports
1
Supply Current
30mA
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
32
Word Size
8b
Number Of Words
512K
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
K6X4008C1F-BF55
Manufacturer:
SAMSUNG
Quantity:
440
Part Number:
K6X4008C1F-BF55
Manufacturer:
SAMSUNG
Quantity:
12
Company:
Part Number:
K6X4008C1F-BF55
Quantity:
58
Part Number:
K6X4008C1F-BF55000
Manufacturer:
SAMSUNG
Quantity:
6 000
Part Number:
K6X4008C1F-BF55T
Manufacturer:
SAMSUNG
Quantity:
5 510
Part Number:
K6X4008C1F-BF55T
Quantity:
5 510
32 PIN THIN SMALL OUTLINE PACKAGE TYPE II (400R)
K6X4008C1F Family
PACKAGE DIMENSIONS
32 PIN THIN SMALL OUTLINE PACKAGE TYPE II (400F)
(
0.037
0.95
(
0.037
0.95
)
#32
#1
)
#32
#1
0.016±
0.40±
0.016±
0.40±
0.10
0.004
0.10
0.004
0.825±
21.35
0.841
20.95±
0.825±
21.35
0.841
20.95±
MAX
0.004
0.10
MAX
0.004
0.10
0.050
1.27
0.050
1.27
9
#16
#17
#17
#16
0.463±
11.76±
0.002
0.039±
0.463±
0.05
11.76±
0.002
1.00 ±
0.039±
0.05
1.00±
0.008
MIN
0.20
MIN
0.004
0.008
0.10
0.20
0.047
0.10
0.004
0.047
1.20
1.20
MAX
MAX
0.004 MAX
0.004 MAX
0.10 MAX
0.10 MAX
0.15
0.15
0.006
0.006
(
(
0.010
0.25
0.010
0.25
+0.10
-0.05
+0.10
-0.05
+0.004
-0.002
+0.004
-0.002
CMOS SRAM
)
)
Units : millimeter(Inch)
0~8°
0~8°
(
0.018 ~ 0.030
(
0.018 ~ 0.030
Revision 2.0
0.020
0.45 ~0.75
March 2005
0.50
0.020
0.45 ~0.75
0.50
)
)

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