LTC5532EDC#PBF Linear Technology, LTC5532EDC#PBF Datasheet - Page 14

• Manufacturer Part Number: LTC5532EDC#PBF
• Manufacturer: Linear Technology

Specifications of LTC5532EDC#PBF

• Pin Count: 6
• Screening Level: Industrial
• Lead Free Status / Rohs Status: Compliant

LTC5532
PACKAGE DESCRIPTIO
14
2.50 0.05
1.15 0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
PIN 1 BAR
0.61 0.05
(2 SIDES)
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
U
1.42 0.05
(2 SIDES)
6-Lead Plastic DFN (2mm 2mm)
(Reference LTC DWG # 05-08-1703)
0.50 BSC
0.75 0.05
0.25 0.05
0.675 0.05
2.00 0.10
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
DC Package
0.56 0.05
(2 SIDES)
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
1.37 0.05
(2 SIDES)
3
4
6
1
0.50 BSC
0.38 0.05
0.25 0.05
PIN 1
CHAMFER OF
EXPOSED PAD
(DC6) DFN 1103
5532f