LT5400AIMS8E-3#TRPBF Linear Technology, LT5400AIMS8E-3#TRPBF Datasheet - Page 7

• Manufacturer Part Number: LT5400AIMS8E-3#TRPBF
• Manufacturer: Linear Technology

Specifications of LT5400AIMS8E-3#TRPBF

• Pin Count: 8
• Screening Level: Industrial
• Lead Free Status / Rohs Status: Compliant

PACKAGE DESCRIPTION
(.0165 ± .0015)
GAUGE PLANE
0.42 ± 0.038
(.007)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
0.18
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
TYP
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
(.010)
0.254
(.074 ± .004)
1.88 ± 0.102
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
DETAIL “A”
DETAIL “A”
(.066 ± .004)
1.68 ± 0.102
(.0256)
0.65
0° – 6° TYP
BSC
(.021 ± .006)
0.53 ± 0.152
8-Lead Plastic MSOP , Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev I)
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
SEATING
PLANE
MS8E Package
(.193 ± .006)
(.118 ± .004)
4.90 ± 0.152
3.00 ± 0.102
(.009 – .015)
0.22 – 0.38
(NOTE 3)
TYP
(.043)
MAX
1.10
EXPOSED PAD OPTION
(.0256)
BOTTOM VIEW OF
0.65
BSC
1
1
8
8
2 3
7 6 5
4
DETAIL “B”
(.074)
1.88
(.118 ± .004)
3.00 ± 0.102
(.0205)
(NOTE 4)
(.034)
0.52
REF
0.86
REF
0.1016 ± 0.0508
(.066)
1.68
(.004 ± .002)
MSOP (MS8E) 0910 REV I
NO MEASUREMENT PURPOSE
THE LEADFRAME FEATURE.
CORNER TAIL IS PART OF
FOR REFERENCE ONLY
DETAIL “B”
0.05 REF
0.29
REF
LT5400
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