LMV225SDX National Semiconductor, LMV225SDX Datasheet - Page 26
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LMV225SDX
Manufacturer Part Number
LMV225SDX
Description
Manufacturer
National Semiconductor
Datasheet
1.LMV225SDX.pdf
(28 pages)
Specifications of LMV225SDX
Pin Count
6
Screening Level
Industrial
Package Type
LLP EP
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LMV225SDX
Manufacturer:
NS/国半
Quantity:
20 000
Physical Dimensions
inches (millimeters) unless otherwise noted
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION” IN THE PACKAGE SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE
(www.national.com).
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BA.
4-Bump micro SMD
NS Package Number TLA04AAA
±
±
±
X1 = 1.014
0.030 mm X2 = 1.014
0.030 mm X3 = 0.600
0.075 mm
www.national.com
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