LX3045 MICROSEMI, LX3045 Datasheet

LX3045

Manufacturer Part Number

LX3045

Description

Manufacturer

MICROSEMI

Datasheet

1.LX3045.pdf (5 pages)

Specifications of LX3045

Lead Free Status / Rohs Status

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Rev. 1.0, 2002-10-29

Photo Diode chips are ideal for high

bandwidth 850nm optical networking

applications.

noise performance and sensitivity in

single die, 1x4 array die or 1x12 array

die.

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

Microsemi’s GaAs Coplanar PIN

The device family offers superior

Coplanar Design (gnd-signal-gnd) 50 ohm

characteristic impedance

125 um standard pad pitch for ease of test

Large 75um x 75um pad size for ease of

packaging

Wire bond or Flip Chip capability

I N T E G R A T E D

0 to 70

(°C)

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Die

LX3044

LX3045

LX3046

Note: Available in Tape & Reel. Append the letter “T” to the part number. (i.e. LX3044T)

D E S C R I P T I O N

Die

P R O D U C T S

Active Area, A

are currently offered in die form

allowing manufacturers the versatility

of custom assembly using either bond

wire or flip chip configurations.

manufacturers of optical receivers,

transponders,

modules and combination PIN photo

diode – transimpedance amplifier.

The LX304X family of photo diodes

This

(µm)

P A C K A G E O R D E R I N F O

P R O D U C T H I G H L I G H T

Integrated Products Division

1. See Package Dimensions (page 4)

device

Microsemi

Single Die

Die Dimension

450

1x12 Die

optical

(µm)

10.3 Gbps Coplanar GaAs PIN Photo Diode

1200

3200

450

transmission

ideal

Pad Dimension

(µm)

for

RODUCTION

Pad Pitch, p

(µm)

LX3044 Single Die

LX3045, 1x4 Array Die

LX3046, 1x12 Array Die

Coplanar Waveguide , 50ohm

High Responsivity

Low Dark Current

High Bandwidth

Anode/Cathode on Illuminated

Side

125mm Pad pitch

Die Good for Bond Wire or Flip

Chip Applications

Short Reach Optical Networks

10Gigabit Ethernet, Fibre

Channel

VCSEL Array Receiver

Large Wirebond Contact Pads

Low Contact Resistance

125

1x4 Die

ATA

K E Y F E A T U R E S

A P P L I C A T I O N S

B E N E F I T S

LX3044 / 45 / 46

HEET

Die Thickness

(µm)

152

203

Page 1

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