SFH 3605-3/4 OSRAM Opto Semiconductors Inc, SFH 3605-3/4 Datasheet
SFH 3605-3/4
Specifications of SFH 3605-3/4
Related parts for SFH 3605-3/4
SFH 3605-3/4 Summary of contents
Page 1
... Features • Narrow angle (±20°) • Low profile component (1,6 mm) • Usable as top-looking and side-looking device SFH 3600: Taping as Toplooker SFH 3605: Taping as Sidelooker • Emitter in same package (SFH 46xx) available Applications • Interrupters, Lightcurtains • Sensors (Consumer, Industrial applications) • ...
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... R 180 thJS 2 / when mounted on PC-board (FR4), padsize 16 mm Symbol Symbol λ S max λ A × × × × SFH 3600, SFH 3605 Einheit Unit ° K/W K/W 2 each Wert Einheit Value Unit 990 nm 500 … 1100 nm 2 0.04 mm 0.35 × 0.35 mm × ...
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... CEO Symbol Symbol -2 I 100 .. 200 PCE 150 CEsat I PCEmin 3 SFH 3600, SFH 3605 Wert Einheit Value Unit ± 20 Grad deg. 1 (≤ 50) nA Wert Value -3 -4 160 ... 320 250 ... 500 μ 150 150 is the min. photocurrent of the specified group. Einheit Unit μ ...
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... Dark Current CEO Collector-Emitter Capacitance MHz 2.5 2.0 1.5 1.0 0 100 SFH 3600, SFH 3605 OHF02432 120˚ Dark Current CEO A 3 OHF02420 10 nA Ι CEO OHF00592 OHF00380 ˚C 100 T A ...
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... Handling indication: The package is casted with silicone. Mechanical stress at the surface of the unit should be as low as possible. 2007-04-03 1) Silicone area 1.7 Isolating area 1.5 (0.8) Pad 2 metallisation 5 SFH 3600, SFH 3605 3.3 2.9 0.75 0.75 0.55 0.55 0.42 0.42 Backside metallisation OHF02956 ...
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... Paddesign for improved heat dissipation Cu-Fläche > Cu-area Lötstopplack Solder resist Verarbeitet als Sidelooker Mounted as sidelooker SFH 3605 Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation Cu-Fläche > Cu-area Lötstopplack Solder resist 2007-04- SFH 3600, SFH 3605 2.4 OHF02422 1.7 OHF02421 ...
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... IR Reflow Soldering: solder point temperature ≥ 235 °C for at least 10 sec. 100 150 2 with the express written approval of OSRAM OS. 7 SFH 3600, SFH 3605 OHLA0687 +0 ˚C 260 ˚C -5 ˚C 245 ˚C ±5 ˚C +5 ˚C 235 ˚C -0 ˚ ...