74LVC1G126GV NXP Semiconductors, 74LVC1G126GV Datasheet - Page 2

Buffers & Line Drivers 3-STATE BUFFER

74LVC1G126GV

Manufacturer Part Number
74LVC1G126GV
Description
Buffers & Line Drivers 3-STATE BUFFER
Manufacturer
NXP Semiconductors
Datasheet

Specifications of 74LVC1G126GV

Logic Family
LVC
Logic Type
CMOS
Number Of Channels Per Chip
1
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.65 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Package / Case
SOT-753-5
High Level Output Current
- 32 mA
Low Level Output Current
32 mA
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
1 / 1
Output Type
3-State
Propagation Delay Time
2.3 ns at 2.7 V
Lead Free Status / Rohs Status
 Details
Other names
74LVC1G126GV,125

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74LVC1G126GV
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
74LVC1G126GV
Quantity:
1 759
Part Number:
74LVC1G126GVЈ¬125
Manufacturer:
NXP
Quantity:
3 000
NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74LVC1G126
Product data sheet
Type number
74LVC1G126GW
74LVC1G126GV
74LVC1G126GM
74LVC1G126GF
74LVC1G126GN
Type number
74LVC1G126GW
74LVC1G126GV
74LVC1G126GM
74LVC1G126GF
74LVC1G126GN
74LVC1G126GS
74LVC1G126GS
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
2
1
Logic symbol
Ordering information
Marking codes
A
OE
mna125
Package
Temperature range
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
Y
4
All information provided in this document is subject to legal disclaimers.
Fig 2.
Rev. 10 — 29 December 2010
Name
TSSOP5
SC-74A
XSON6
XSON6
XSON6
XSON6
2
1
IEC logic symbol
OE
Marking
VN
V26
VN
VN
VN
VN
mna126
plastic extremely thin small outline package;
plastic extremely thin small outline package;
extremely thin small outline package; no leads;
Description
plastic thin shrink small outline package;
5 leads; body width 1.25 mm
plastic surface-mounted package; 5 leads
no leads; 6 terminals; body 1  1.45  0.5 mm
no leads; 6 terminals; body 1  1  0.5 mm
6 terminals; body 0.9  1.0  0.35 mm
extremely thin small outline package; no leads;
6 terminals; body 1.0  1.0  0.35 mm
[1]
4
Fig 3.
OE
A
Bus buffer/line driver; 3-state
Logic diagram
74LVC1G126
© NXP B.V. 2010. All rights reserved.
Version
SOT353-1
SOT753
SOT886
SOT891
SOT1115
SOT1202
mna127
2 of 19
Y

Related parts for 74LVC1G126GV