MAX14979EETX+ Maxim Integrated Products, MAX14979EETX+ Datasheet - Page 2

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MAX14979EETX+

Manufacturer Part Number
MAX14979EETX+
Description
IC SWITCH HIGH BW LVDS 36TQFN
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX14979EETX+

Function
Switch
Circuit
4 x DPDT
On-state Resistance
5.5 Ohm
Voltage Supply Source
Single Supply
Voltage - Supply, Single/dual (±)
3 V ~ 3.6 V
Current - Supply
280µA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
36-WFQFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
High-Bandwidth, ±15kV ESD Protection
LVDS Switch
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND.)
V+ .........................................................................-0.3V to +4.0V
All Other Pins ...............................................-0.3V to (V+ + 0.3V)
Continuous Current (COM_ _ to NC_ _/NO_ _) ............ Q120mA
Continuous Current (AUX0_ to AUX1_/AUX2_) ............... Q40mA
Peak Current (COM_ _ to NC_ _/NO_ _)
Current into Any Other Pin .............................................. Q20mA
Continuous Power Dissipation (T
ESD Protection, Human Body Model (HBM) ....................Q15kV
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V+ = +3.0V to +3.6V, T
2
POWER SUPPLIES
Operating Power-Supply Range
ANALOG SWITCH
On-Resistance
On-Resistance AUX Switches
On-Resistance Match
Between Channels
On-Resistance Flatness
Off-Leakage Current
On-Leakage Current
SWITCH AC PERFORMANCE
Insertion Loss
Return Loss
Crosstalk
SWITCH AC CHARACTERISTICS
-3dB Bandwidth
Off-Capacitance
On-Capacitance
(pulsed at 1ms, 10% duty cycle) ............................... Q240mA
36-Pin TQFN (derate 35.7mW/NC above +70NC) .......2.85mW
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
A
= T
J
= T
A
= +70NC)
MIN
R
SYMBOL
R
FLAT(ON)
I
I
LCOM_
LCOM_
DR
_(OFF)
to T
ONAUX
_(ON)
R
C
V
V
C
R
I
BW
LOS
V+
LOS
CT1
CT2
OFF
ON
ON
ON
MAX
, unless otherwise noted. Typical values are at V+ = +3.3V, T
V+ = 3V, I
V
V+ = 3V, I
1.5V, 3V
V+ = 3V, I
V
V+ = 3V, I
V
V+ = 3.6V, V
V
V+ = 3.6V, V
or V
R
(Note 3)
f = 100MHz
Any switch to any switch;
R
unbalanced, Figure 1
R
f = 1MHz, COM_ _
f = 1MHz, COM_ _
COM_ _
COM_ _
COM_ _
NC_ _
S
S
S
= R
= R
= R
NO_ _
L
L
L
or V
= 50I, unbalanced, f = 1MHz,
= 50I,
= 50I, unbalanced
= 0V, 1.5V, 3V
= 0V, 3V (Note 3)
= 0V, 1.5V
COM_ _
AUX0_
COM_ _
COM_ _
= 3.3V, 0.3V or unconnected
NO_ _
COM_ _
COM_ _
CONDITIONS
= -40mA, V
= 3.3V, 0.3V
= -40mA,
= -40mA,
= -40mA,
Junction-to-Ambient Thermal Resistance
Junction-to-Case Thermal Resistance
Operating Temperature Range ........................ -40NC to +85NC
Junction Temperature .................................................. +150NC
Storage Temperature Range ......................... -65NC to +150NC
Lead Temperature (soldering 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
= 0.3V, 3.3V;
= 0.3V, 3.3V; V
B
B
JA
JC
(Note 1) ...................................................................8NC/W
(Note 1) ...................................................................1NC/W
AUX0_
T
T
T
T
f = 25MHz
f = 125MHz
A
MIN
A
MIN
= +25NC
= +25NC
= 0V,
to T
to T
NC_ _
MAX
MAX
+3.0
MIN
-1
-1
TYP
0.01
650
-23
-50
-26
0.5
0.6
3.5
4
8
A
= +25NC.) (Note 2)
MAX
+3.6
5.5
6.5
1.5
40
+1
+1
2
UNITS
MHz
FA
FA
dB
dB
dB
pF
pF
I
I
I
I
V

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