LTC3225EDDB-1#PBF Linear Technology, LTC3225EDDB-1#PBF Datasheet - Page 12

• Manufacturer Part Number: LTC3225EDDB-1#PBF
• Manufacturer: Linear Technology

Specifications of LTC3225EDDB-1#PBF

• Lead Free Status / Rohs Status: Supplier Unconfirmed

LTC3225/LTC3225-1
PACKAGE DESCRIPTION
12
2.55 0.05
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.15 0.05
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
0.25 0.05
0.64 0.05
(2 SIDES)
2.39 0.05
(2 SIDES)
0.50 BSC
0.70 0.05
PACKAGE
OUTLINE
(Reference LTC DWG # 05-08-1722 Rev Ø)
10-Lead Plastic DFN (3mm × 2mm)
(SEE NOTE 6)
TOP MARK
PIN 1 BAR
0.200 REF
DDB Package
3.00 0.10
(2 SIDES)
0.75 0.05
2.00 0.10
(2 SIDES)
0 – 0.05
R = 0.05
0.64 0.05
(2 SIDES)
TYP
0.25 0.05
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
5
6
2.39 0.05
(2 SIDES)
10
1
0.50 BSC
0.40 0.10
PIN 1
R = 0.20 OR
0.25 45
CHAMFER
(DDB10) DFN 0905 REV Ø
3225fb