LFXP6E-5QN208C Lattice, LFXP6E-5QN208C Datasheet - Page 115
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LFXP6E-5QN208C
Manufacturer Part Number
LFXP6E-5QN208C
Description
IC FPGA 5.8KLUTS 208PQFP
Manufacturer
Lattice
Datasheet
1.LFXP6C-3TN144C.pdf
(130 pages)
Specifications of LFXP6E-5QN208C
Number Of Logic Elements/cells
*
Number Of Labs/clbs
*
Total Ram Bits
*
Number Of I /o
*
Number Of Gates
*
Voltage - Supply
*
Mounting Type
*
Operating Temperature
*
Package / Case
*
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP6E-5QN208C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Pinout Information
Lattice Semiconductor
LatticeXP Family Data Sheet
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following located on the Lattice website at
www.latticesemi.com.
• Thermal Management document
• Technical Note TN1052 - Power Estimation and Management for LatticeECP/EC and LatticeXP Devices
• Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from
www.latticesemi.com/software
4-56
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