HMC1041Z Honeywell, HMC1041Z Datasheet - Page 4

• Manufacturer Part Number: HMC1041Z
• Manufacturer: Honeywell

Specifications of HMC1041Z

• Lead Free Status / Rohs Status: Compliant

HMC1041Z
MOUNTING CONSIDERATIONS
The following is the recommend printed circuit board (PCB) footprint for the HMC1041Z. The two small (0.5mm by 0.5mm)
leveling pads are to hold the part square to the PCB and should receive the same pad finish as the rest of the pads but
without additional solder paste. The goal is to hold the part vertical surfaces perpendicular to the board surface. All
dimensions are nominal and in millimeters.
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the eight electrical contact pads. Do not apply paste on the
leveling pads. The HMC1041Z has been tested successfully with no-clean solder paste.
Pick and Place
Placement is machine dependant and no restrictions are recommended, and have be tested with mechanical centering.
Placement force should be equivalent 1206 SMT resistors and enough force should be used to squeeze the paste out
from the package/contact pad overlap and to keep the package pin contacts vertical. The low mass of the HMC1041Z
ensures that very little paste is required to hold the part until reflow.
Reflow and Rework
No special profile is required for the HMC1041Z, and compatible with lead eutectic and lead-free solder paste reflow
profiles. Honeywell recommends the adherence to solder paste manufacturer’s guidelines. The HMC1041Z may be
reworked with soldering irons, but extreme care must be taken not to overheat the copper pads from the part’s fiberglass
substrate. Irons with a tip temperature no greater than 315°C should be used. Excessive rework risks the copper pads
pulling away into the molten solder.
BASIC DEVICE OPERATION
The Honeywell HMC1041Z magnetoresistive sensor is a Wheatstone bridge device to measure magnetic fields. With
power supply applied to a bridge, the sensor converts any incident magnetic field in the sensitive axis direction to a
differential voltage output. In addition to the bridge circuit, the sensor has two on-chip magnetically coupled straps; the
offset strap and the set/reset strap. These straps are Honeywell patented features for incident field adjustment and
magnetic domain alignment; and eliminate the need for external coils positioned around the sensors.
The magnetoresistive sensors are made of a nickel-iron (Permalloy) thin-film deposited on a silicon wafer and patterned
as a resistive strip element. In the presence of a magnetic field, a change in the bridge resistive elements causes a
corresponding change in voltage across the bridge outputs.
4
Bottom
Bottom
View
View
Back
Back
View
View
0.30
0.30
1.05
1.05
0.20
0.20
0.50
0.50
1.75
1.75
0.50
0.50
0.50
0.50
0.60
0.60
0.50
0.50
Pin 1
Pin 1
0.40
0.40
No Paste
No Paste
View
View
Side
Side
Pad
Pad
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Pad
Pad
Solder
Solder
Filet
Filet
Pin Contact
Pin Contact