HI-1567PSI Holt Integrated Circuits, HI-1567PSI Datasheet
HI-1567PSI
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HI-1567PSI Summary of contents
Page 1
... CMOS / TTL data suitable for inputting to a Manchester decoder. Each receiver has a separate enable input which can be used to force the output of the receiver to a logic 0 (HI-1567) or logic 1 (HI-1568). To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to each coupling transformer ...
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... CMOS/TTL data at the RXA/B and output pins. Each set of receiver outputs can be independently forced TXA logic "0" (HI-1567) or logic “1” (HI-1568) by setting RXENA or RXENB low. BUSA MIL-STD-1553 BUS INTERFACE A direct coupled interface (see Figure 2) uses a 1:2.5 ratio isolation transformer and two 55 ohm isolation resistors between the transformer and the bus ...
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... RECEIVER RXA/B Receive Logic RXA/B Comparator RXENA/B TXA/B TXA/B BUSA/B - BUSA/B Vin (Line to Line) RXA/B RXA/B HI-1567, HI-1568 BUSA/B BUSA/B Input Filter Figure 1. Block Diagram TRANSMIT WAVEFORM - EXAMPLE PATTERN RECEIVE WAVEFORMS - EXAMPLE PATTERN HOLT INTEGRATED CIRCUITS 3 Data Bus Isolation Coupler Transformer ...
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... Supply Voltage -0 +5.5 V VDD....................................... 5V... ±5% 10 Vp-p Temperature Range +1.0 A Industrial Screening.........-40°C to +85°C Hi-Temp Screening........-55°C to +125°C 1.0 W 7mW/°C NOTE: 275°C for 10 sec. ratings or outside recommended operating conditions may cause permanent damage to the 175°C device. These are stress ratings only. Operation at the limits is not recommended. -65° ...
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... C 1 MHz sine wave OUT TEST CONDITIONS From input zero crossing to RXA/B or RXA/B From RXENA/B rising or falling edge to RXA/B or RXA/B TXA/B, TXA/B to BUSA/B, BUSA/B 35 ohm load 35 ohm load Inhibited output Active output 1:2.5 BUSA/B BUSA/B Isolation Transformer 2.5 Isolation Transformer RXENA/B ...
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... Zo) Figure 3. Transformer Coupled Test Circuits HEAT SINK - ESOIC & CHIP-SCALE PACKAGE Both the HI-1567PSI/T/M and HI-1568PSI/T/M use a 20-pin thermally enhanced SOIC package. The HI-1567PCI/T and HI-1568PCI/T use a plastic chip-scale package. These packages include a metal heat sink located on the bottom surface of the device. This heat ...
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... TO +85° -55°C TO +125°C T -55°C TO +125°C M YES PACKAGE DESCRIPTION 44 PIN PLASTIC CHIP-SCALE LPCC (44PCS) not available with ‘M’ flow 20 PIN PLASTIC ESOIC (Thermally Enhanced Wide SOIC w/Heat Sink, 20HWE) RXENA = 0 RXENB = 0 RXA RXA RXB RXB ...
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... REVISION HISTORY Document Rev. Date Description of Change DS1567 O 09/26/08 Clarification of transmitter and receiver functions in Description, clarified available temperature ranges, and corrected a dimension in Recommended Transformers table. P 07/24/09 Corrected typographical errors in package dimensions. HI-1567, HI-1568 HOLT INTEGRATED CIRCUITS 8 ...
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... TYP. (1.270 TYP.) .085 ±.009 (2.159 ± .229) .100 BSC (2.54) .017 ±.002 (.432 ±.051) HOLT INTEGRATED CIRCUITS 9 inches (millimeters) Package Type: 20HWE .290 typ (7.37) Bottom typ View Electrically isolated heat sink pad on bottom of package ...
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... PLASTIC CHIP-SCALE PACKAGE .276 BSC (7.00) .276 Top View BSC (7.00) .039 max (1.00) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) PACKAGE DIMENSIONS .203 ± .006 (5.15 ± .15) Electrically isolated heat sink ...