IRF7317TR International Rectifier, IRF7317TR Datasheet

07B1418

IRF7317TR

Manufacturer Part Number
IRF7317TR
Description
07B1418
Manufacturer
International Rectifier
Datasheet

Specifications of IRF7317TR

Transistor Polarity
N And P Channel
Continuous Drain Current Id
6.6A
Drain Source Voltage Vds
20V
On Resistance Rds(on)
29mohm
Rds(on) Test Voltage Vgs
4.5V
Threshold Voltage Vgs Typ
700mV
Rohs Compliant
No

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Thermal Resistance Ratings
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in a wide variety of applications.
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics and
multiple-die capability making it ideal in a variety of
power applications.
multiple devices can be used in an application with
dramatically reduced board space. The package is
designed for vapor phase, infra red, or wave soldering
techniques.
Absolute Maximum Ratings ( T
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
Maximum Power Dissipation
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
Generation V Technology
Ultra Low On-Resistance
Dual N and P Channel MOSFET
Surface Mount
Fully Avalanche Rated
With these improvements,
Parameter
A
T
T
T
T
= 25°C Unless Otherwise Noted)
PRELIMINARY
A
A
A
A
= 25°C
= 70°C
= 25°C
= 70°C
G 2
G 1
S2
S 1
T
Symbol
dv/dt
J,
V
V
E
E
I
I
DM
T
AR
I
GS
AR
DS
S
AS
N -C H A N N EL M O S FET
1
2
3
P -C H AN N E L MO S FET
4
STG
T o p V ie w
Symbol
N-Channel
R
HEXFET
JA
8
100
7
6
5
6.6
5.3
2.5
4.1
5.0
20
26
-55 to + 150 °C
Maximum
D 1
D 1
D 2
D 2
S O -8
± 12
0.20
2.0
1.3
R
V
®
P-Channel
DS(on)
DSS
IRF7317
Limit
Power MOSFET
62.5
-5.3
-4.3
-2.5
150
-2.9
-5.0
-20
-21
0.029
N-Ch
20V
PD - 9.1568B
Units
Units
°C/W
0.058
V/ ns
-20V
P-Ch
mJ
mJ
W
A
A
12/9/97

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IRF7317TR Summary of contents

Page 1

... Dual N and P Channel MOSFET Surface Mount Fully Avalanche Rated Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power ...

Page 2

IRF7317 Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(ON) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS I ...

Page 3

VGS TOP 7.50V 4.50V 4.00V 3.50V 3.00V 2.70V 2.00V BOTTOM 1.50V 10 1.50V 20µs PULSE WIDTH 0 Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 100 ° ...

Page 4

IRF7317 2.0 6. 1.5 1.0 0.5 0.0 -60 -40 - Junction Temperature Fig 5. Normalized On-Resistance Vs. Temperature 0.05 0.04 0. 6.6A D 0.02 0. ...

Page 5

iss rss oss 1200 C ...

Page 6

IRF7317 100 VGS TOP -7.50V -4.50V -4.00V -3.50V -3.00V -2.70V -2.00V BOTTOM -1.50V 10 -1.50V 1 20µs PULSE WIDTH 0.1 0 Drain-to-Source Voltage (V) DS Fig 12. Typical Output Characteristics 100 T ...

Page 7

I = -2.9A D 1.5 1.0 0.5 0.0 -60 -40 - Junction T em perature (° Fig 16. Normalized On-Resistance Vs. Temperature 0.08 0.07 0.06 I ...

Page 8

IRF7317 1400 1200 oss ds gd 1000 C is ...

Page 9

Package Outline SO8 Outline 0.25 (.010 0.25 (.010) ...

Page 10

IRF7317 Tape & Reel Information SO8 Dimensions are shown in millimeters (inches 8.1 ( .318 ) 7.9 ( .312 ) ...

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