MT47H64M16HR-3:HTR Micron Technology Inc, MT47H64M16HR-3:HTR Datasheet - Page 21
![no-image](/images/manufacturer_photos/0/4/441/micron_technology_inc_sml.jpg)
MT47H64M16HR-3:HTR
Manufacturer Part Number
MT47H64M16HR-3:HTR
Description
Manufacturer
Micron Technology Inc
Datasheet
1.MT47H64M16HR-3HTR.pdf
(136 pages)
Specifications of MT47H64M16HR-3:HTR
Lead Free Status / Rohs Status
Compliant
- Current page: 21 of 136
- Download datasheet (3Mb)
Figure 10: 60-Ball FBGA (8mm x 10mm) – x4, x8
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. W 7/11 EN
10 ±0.1
60X Ø0.45
Dimensions
apply to solder
balls post-reflow
on Ø0.35 SMD
ball pads.
8 CTR
0.8 TYP
0.155
Notes:
9
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
8
Nonconductive
36%Pb, 2% Ag).
7
overmold
1.8 CTR
6.4 CTR
8 ±0.1
0.8 TYP
3
2
1
B
C
D
E
F
G
H
K
L
A
J
21
A
Ball A1 ID
Exposed gold plated pad
1.0 MAX X 0.7 nominal.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Seating plane
0.12 A
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.1 ±0.1
2007 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging
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