NVMFD5877NLT1G ON Semiconductor, NVMFD5877NLT1G Datasheet - Page 6

• Manufacturer Part Number: NVMFD5877NLT1G
• Description: MOSFET N-CH 60V 17A 8SOIC
• Manufacturer: ON Semiconductor
• Series: -r

Specifications of NVMFD5877NLT1G

• Fet Type: 2 N-Channel (Dual)
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 39 mOhm @ 7.5A, 10V
• Drain To Source Voltage (vdss): 60V
• Current - Continuous Drain (id) @ 25° C: 6A
• Vgs(th) (max) @ Id: 3V @ 250µA
• Gate Charge (qg) @ Vgs: 5.9nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 540pF @ 25V
• Power - Max: 3.2W
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
NOTE 4
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ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
IDENTIFIER
NOTE 7
PIN ONE
0.10 C
0.10 C
DETAIL B
M
4X
N
G
BOTTOM VIEW
É É É É
É É
1
8
8
SIDE VIEW
1
e
TOP VIEW
D3
7
2
D2
D1
D
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
6
3
4
5
5
4
2X
4X
b1
DETAIL A
4X
E1
8X
A
A
0.20 C
L
0.10
0.05
b
E2
E
K
B
C
DFN8 5x6, 1.27P Dual Flag (SO8FL−Dual)
C
c
SEATING
c
2X
PLANE
NOTE 6
A
NOTE 3
*For additional information on our Pb−Free strategy and soldering
B
0.20 C
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
4.84
DETAIL A
0.70
http://onsemi.com
4X
2.30
CASE 506BT
1.00
0.75
8X
ISSUE B
SOLDERING FOOTPRINT*
6
4X
h
A1
1.27
PITCH
NOTES:
4.56
5.55
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED
4. PROFILE TOLERANCE APPLIES TO THE EXPOSED PAD AS WELL
5. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD FLASH,
6. SEATING PLANE IS DEFINED BY THE TERMINALS. A1 IS DEFINED
7. A VISUAL INDICATOR FOR PIN 1 MUST BE LOCATED IN THIS AREA.
BETWEEN 0.15 AND 0.30 MM FROM THE TERMINAL TIP.
AS THE TERMINALS.
PROTRUSIONS, OR GATE BURRS.
AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
CONSTRUCTION
DIMENSION: MILLIMETERS
DETAIL B
ALTERNATE
2.08
2X
1.40
4X
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
3.70
6.59
0.56
2X
DIM
A1
D1
D2
D3
NVMFD5877NL/D
b1
E1
E2
A
D
E
G
K
M
N
b
c
e
h
L
MILLIMETERS
MIN
0.90
0.33
0.33
0.20
4.50
3.90
1.50
5.50
3.90
0.45
0.51
0.48
3.25
1.80
−−−
−−−
5.15 BSC
6.15 BSC
1.27 BSC
MAX
1.10
0.05
0.51
0.51
0.33
5.10
4.30
1.90
6.10
4.40
0.65
12
0.71
3.75
2.20
−−−
_