MC10H116D ON Semiconductor, MC10H116D Datasheet
MC10H116D
Specifications of MC10H116D
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MC10H116D Summary of contents
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... For PLCC pin assignment, see TND309, the Pin Conversion Tables, page 9. Figure 2. Dip Pin Assignment *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 10 ...
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Table 1. MAXIMUM RATINGS Symbol V Power Supply ( Input Voltage ( Output Current − Continuous out − Surge T Operating Temperature Range A T Storage Temperature Range − Plastic ...
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... ORDERING INFORMATION Device MC10H116D MC10H116DG MC10H116DR2 MC10H116DR2G MC10H116FN MC10H116FNG MC10H116FNR2 MC10H116FNR2G MC10H116L MC10H116M MC10H116MG MC10H116MEL MC10H116MELG MC10H116P MC10H116PG †For information on tape and reel specifications,including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package SO−16 SO− ...
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Y BRK −L− −M− 0.007 (0.180) Z 0.007 (0.180 −T− J VIEW S G1 0.010 (0.250) T L− NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, ...
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0.25 (0.010) −A− 0.25 (0.010) M PACKAGE DIMENSIONS CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE ...
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... E L DETAIL P VIEW P N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. ...