M25P40-VMP6TGB Micron Technology Inc, M25P40-VMP6TGB Datasheet - Page 53

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M25P40-VMP6TGB

Manufacturer Part Number
M25P40-VMP6TGB
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of M25P40-VMP6TGB

Cell Type
NOR
Density
4Mb
Access Time (max)
8ns
Interface Type
Serial (SPI)
Boot Type
Not Required
Address Bus
1b
Operating Supply Voltage (typ)
2.5/3.3V
Operating Temp Range
-40C to 85C
Package Type
MLP EP
Program/erase Volt (typ)
2.3 to 3.6V
Sync/async
Synchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.3V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
512K
Supply Current
8mA
Mounting
Surface Mount
Pin Count
8
Lead Free Status / Rohs Status
Compliant

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Table 27.
1. Maximum package warpage is 0.05 mm; maximum allowable burrs is 0.076 mm in all directions; and
2. N is the total number of terminals.
3. ND refers to the number of terminals on D side.
4. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30 mm from terminal tip.
Symbol
bilateral coplanarity zone applies to the exposed heat sink slug as well as to the terminals; N is the total
number of terminals.
if the terminal has the optional radius on the other end of the terminal, The dimension b should not be
measured in that radius area.
ND
N
b
D2
A1
A3
E2
A
D
E
θ
e
L
(4)
(2)
(3)
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead,
4 x 3 mm package mechanical data
0.55
0.02
0.80
0.20
0.80
0.30
0.60
4.00
3.00
Typ
8
4
Databook (mm)
0.127
0.45
0.00
0.70
0.10
0.25
0.55
3.90
2.90
Min
Max
0.60
0.05
0.15
0.90
0.30
0.35
0.65
4.10
3.10
12°
(1)
0.55
0.02
0.80
0.20
0.80
0.30
0.60
4.00
3.00
Typ
8
4
Drawing (mm)
0.127
0.45
0.00
0.70
0.10
0.25
0.55
3.90
2.90
Min
0.35
Max
0.60
0.05
0.15
0.90
0.30
0.65
4.10
3.10
12°
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