LT6660KCDC-3.3#PBF Linear Technology, LT6660KCDC-3.3#PBF Datasheet - Page 11

• Manufacturer Part Number: LT6660KCDC-3.3#PBF
• Manufacturer: Linear Technology

Specifications of LT6660KCDC-3.3#PBF

• Operating Temperature (max): 70C
• Operating Temperature (min): 0C
• Pin Count: 3
• Mounting: Surface Mount
• Package Type: DFN EP
• Case Length: 2mm
• Screening Level: Commercial
• Lead Free Status / Rohs Status: Compliant

PACKAGE DESCRIPTIO
2.00 ±0.05
1.30 ±0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
PIN 1 BAR
1.00 ±0.05
(2 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (W-TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
U
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
1.35 ±0.05
(Reference LTC DWG # 05-08-1717 Rev Ø)
(2 SIDES)
3-Lead Plastic DFN (2mm × 2mm)
0.50 BSC
0.00 – 0.05
0.75 ±0.05
0.25 ± 0.05
2.00 ±0.10
DC Package
(4 SIDES)
PACKAGE
OUTLINE
1.00 ± 0.05
0.40 ±0.05
0.70 ±0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
1.35 ± 0.05
(2 SIDES)
3
1
0.50 BSC
(DC3) DFN 1205 REV Ø
0.25 ± 0.05
R = 0.05
TYP
R = 0.115 TYP
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
LT6660
11
6660fa