DS3174+ Maxim Integrated Products, DS3174+ Datasheet - Page 46
![IC TXRX DS3/E3 QUAD 400-BGA](/photos/6/87/68748/400-bga_21-0306_sml.jpg)
DS3174+
Manufacturer Part Number
DS3174+
Description
IC TXRX DS3/E3 QUAD 400-BGA
Manufacturer
Maxim Integrated Products
Datasheet
1.DS3171N.pdf
(234 pages)
Specifications of DS3174+
Function
Single-Chip Transceiver
Interface
DS3, E3
Number Of Circuits
4
Voltage - Supply
3.135 V ~ 3.465 V
Current - Supply
725mA
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
400-BGA
Includes
DS3 Framers, E3 Framers, HDLC Controller, On-Chip BERTs
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
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Figure 8-25. Clear Status Latched Register on Read
Figure 8-26. Clear Status Latched Register on Write
Figure 8-27
times to write or read to or from various memory locations on the DS317x device. Some registers will have a faster
access time than others will and if needed, the user can implement the RDY signal to maximize efficiency of read
and write accesses.
A[0]/BSWAP
A[0]/BSWAP
A[10:1]
D[15:0]
A[10:1]
D[15:0]
RDY
RD
WR
CS
RDY
WR
RD
CS
and
Z
Figure
Z
0x1C0
8-28show exaggerated views of the Ready Signal to describe the difference in access
0x1C0
0xFFFF
0xFFFF
Z
Z
Z
Z
0x5555
46
0x1C0
0x1C0
0x0000
Z
Z
Z
0x1C0
0xAAAA
Z
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