C2012X5R0J106M/0.85 TDK Corporation, C2012X5R0J106M/0.85 Datasheet - Page 21
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C2012X5R0J106M/0.85
Manufacturer Part Number
C2012X5R0J106M/0.85
Description
CAP CER 10UF 6.3V 20% X5R 0805
Manufacturer
TDK Corporation
Series
Cr
Datasheets
1.C1005X7R1E103K.pdf
(1 pages)
2.C2012X7R1A106K.pdf
(46 pages)
3.C2012X5R1A225M0.85.pdf
(72 pages)
Specifications of C2012X5R0J106M/0.85
Capacitance
10µF
Voltage - Rated
6.3V
Tolerance
±20%
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Applications
General Purpose
Ratings
-
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Height - Seated (max)
-
Thickness (max)
0.037" (0.95mm)
Lead Spacing
-
Features
-
Lead Style
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-7675-2
No.
5
Soldering
Process
5-4. Avoiding thermal shock
1)
2)
5-5. Amount of solder
5-6. Solder repair by solder iron
1) Selection of the soldering iron tip
Preheating condition
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (∆T) must be less than 100°C.
Cooling condition
Excessive
solder
Adequate
Insufficient
solder
Tip temperature of solder iron varies by its type, P.C.board material and solder
land size. The higher the tip temperature, the quicker the operation. However,
heat shock may cause a crack in the chip capacitors.
Please make sure the tip temp. before soldering and keep the peak temp and
time in accordance with following recommended condition. (Please preheat the
chip capacitors with the condition in 5-4 to avoid the thermal shock.)
Recommended solder iron condition (Pb-Sn Solder and Lead Free Solder)
Excessive solder will induce higher tensile force in chip capacitors when
temperature changes and it may result in chip cracking. In sufficient solder may
detach the capacitors from the P.C.board.
Manual soldering
Reflow soldering
Wave soldering
Temp. (°C)
300 max.
Soldering
—— 20 ——
Duration (sec.)
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
3 max.
Condition
Type
Wattage (W)
20 max.
Maximum amount
Minimum amount
Higher tensile force in
chip capacitors to cause
crack
Low robustness may
cause contact failure or
chip capacitors come off
the P.C.board.
Shape (mm)
Ø 3.0 max.
Temp. (°C)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130