C2012X5R0J156M/1.25 TDK Corporation, C2012X5R0J156M/1.25 Datasheet - Page 13

• Manufacturer Part Number: C2012X5R0J156M/1.25
• Description: CAP CER 15UF 6.3V X5R 0805
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C2012X5R0J156M/1.25

• Capacitance: 15µF
• Voltage - Rated: 6.3V
• Tolerance: ±20%
• Temperature Coefficient: X5R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 85°C
• Applications: General Purpose
• Ratings: -
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (max): -
• Thickness (max): 0.057" (1.45mm)
• Lead Spacing: -
• Features: -
• Lead Style: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 445-7677-2

Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness : Appendix-2a
Applied for C0603, C1005, C1608, C2012, C3216
(Unit : mm)
P.C. Board for reliability test
P.C. Board for bending test
c
Solder resist
Solder resist
Applied for C0603, C1005
Copper ( thickness 0.035mm )
Solder resist
Appendix - 1a
Appendix - 2a
100
Appendix-1a, 1b, 2b
b
100
Copper
b
a
(Unit：mm)
Copper
1.6mm
—— 12 ——
0.8mm
Applied for C1608, C2012, C3216, C3225, C4532, C5750
P.C. Board for reliability test
C0603 (CC0201)
C1005 (CC0402)
C1608 (CC0603)
C2012 (CC0805)
C3216 (CC1206)
C3225 (CC1210)
C4532 (CC1812)
C5750 (CC2220)
P.C. Board for bending test
TDK (EIA style)
c
Solder resist
Applied for C3225, C4532, C5750
Slit
Appendix - 1b
Appendix - 2b
100
b
100
Solder resist
a
0.3
0.4
1.0
1.2
2.2
2.2
3.5
4.5
a
Dimensions (mm)
Copper
0.8
1.5
3.0
4.0
5.0
5.0
7.0
8.0
(Unit : mm)
b
Copper
(Unit : mm)
1.65
0.3
0.5
1.2
2.0
2.9
3.7
5.6
c