SI3050-KT Silicon Laboratories Inc, SI3050-KT Datasheet - Page 105

IC VOICE DAA GCI/PCM/SPI 20TSSOP

SI3050-KT

Manufacturer Part Number
SI3050-KT
Description
IC VOICE DAA GCI/PCM/SPI 20TSSOP
Manufacturer
Silicon Laboratories Inc
Type
Chipsetr
Datasheets

Specifications of SI3050-KT

Package / Case
20-TSSOP
Function
Data Access Arrangement (DAA)
Interface
PCM, Serial, SPI
Number Of Circuits
1
Voltage - Supply
3 V ~ 3.6 V
Current - Supply
8.5mA
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Includes
Line Voltage Monitor, Loop Current Monitor, Overload Detection, Parallel Handset Detection, Polarity Reversal Detection, TIP and
Product
Modem Chip
Supply Voltage (min)
3 V
Supply Current
8.5 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Power (watts)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SI3050-KT
Manufacturer:
SILICONIX
Quantity:
20 000
Part Number:
SI3050-KTR
Manufacturer:
NEC
Quantity:
947
Part Number:
SI3050-KTR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
Company:
Part Number:
SI3050-KTR
Quantity:
2 278
13. Package Outline: 16-Pin TSSOP
Figure 51 illustrates the package details for the Si3018/19. Table 28 lists the values for the dimensions shown in
the illustration.
ddd C B A
bbb
B
A
M
Figure 51. 16-Pin Thin Shrink Small Outline Package (TSSOP)
b
C B A
16
1
Symbol
Table 28. Package Diagram Dimensions
aaa
bbb
ddd
A1
E
θ
D
A
E
b
c
e
L
1
1
aaa C
D
0.05
0.19
0.09
4.90
4.30
0.45
Min
9
e
8
Rev. 1.1
E
Millimeters
1
0.65 BSC
6.40 BSC
A1
Nom
E
5.00
4.40
0.10
0.10
0.20
0.6
A
C
θ
1
Max
1.20
0.15
0.30
0.20
5.10
4.50
0.75
L
Si3050
C
105

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