SI3209-A-GMR Silicon Laboratories Inc, SI3209-A-GMR Datasheet - Page 32
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SI3209-A-GMR
Manufacturer Part Number
SI3209-A-GMR
Description
Manufacturer
Silicon Laboratories Inc
Datasheet
1.SI3209-A-GMR.pdf
(38 pages)
Specifications of SI3209-A-GMR
Lead Free Status / Rohs Status
Supplier Unconfirmed
Si3208/9
32
QFN Pin #
epad
35
36
37
38
39
40
Symbol
VBAT_1
AGND
NC
IC
IC
IC
Table 18. Si3208/9 Pin Descriptions (Continued)
I/O
I
I
Preliminary Rev. 0.33
No Connect.
Analog Ground.
Internal connection; leave to float.
Internal connection; leave to float.
Operating Battery Voltage Channel 1 Input.
Internal connection; leave to float.
Exposed Die Attach Paddle.
For adequate thermal management, the exposed die paddle
should be soldered to a printed circuit board pad that is connected
to an electrically-isolated low-impedance inner layer and/or back-
side thermal plane(s) using multiple thermal vias. Do not connect
this pad to ground.
Description