SI3200-FSR Silicon Laboratories Inc, SI3200-FSR Datasheet - Page 106
SI3200-FSR
Manufacturer Part Number
SI3200-FSR
Description
Manufacturer
Silicon Laboratories Inc
Datasheet
1.SI3200-FSR.pdf
(112 pages)
Specifications of SI3200-FSR
Lead Free Status / Rohs Status
Compliant
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Si3220/25 Si3200/02
106
Pin #(s)
epad
12
13
14
15
16
Symbol
IRINGN
IRINGP
THERM
ITIPN
ITIPP
GND
Output
Input/
O
I
I
I
I
Description
Negative RING Current Control.
Connect to the IRINGN lead of the Si3220 or Si3225.
Positive RING Current Drive.
Connect to the IRINGP lead of the Si3220 or Si3225.
Thermal Sensor.
Connect to THERM pin of Si3220 or Si3225.
Negative TIP Current Control.
Connect to the ITIPN lead of the Si3220 or Si3225.
Positive TIP Current Control.
Connect to the ITIPP lead of the Si3220 or Si3225.
Exposed Die Paddle Ground.
For adequate thermal management, the exposed die paddle should be sol-
dered to a PCB pad that is connected to low-impedance inner and/or back-
side ground planes using multiple vias. See “7. Package Outline: 16-Pin
ESOIC” for PCB pad dimensions.
Rev. 1.3
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