KHX1600C9D3K4/16GX KINGSTON TECHNOLOGY, KHX1600C9D3K4/16GX Datasheet

KHX1600C9D3K4/16GX

Manufacturer Part Number

KHX1600C9D3K4/16GX

Description

Manufacturer

KINGSTON TECHNOLOGY

Datasheet

1.KHX1600C9D3K416GX.pdf (2 pages)

Specifications of KHX1600C9D3K4/16GX

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Memory Module Specifications

KHX1600C9D3K4/16GX

16GB (4GB 512M x 64-Bit x 4 pcs.) DDR3-1600MHz

CL9 240-Pin DIMM Kit

DESCRIPTION

Kingston’s KHX1600C9D3K4/16GX is a kit of four 512M x

64-bit 4GB (4096MB) DDR3-1600MHz CL9 SDRAM (Syn-

chronous DRAM) memory modules, based on sixteen 256M

x 8-bit DDR3 FBGA components per module. Each module

kit supports Intel

capacity is 16GB. Each module kit has been tested to run at

DDR3-1600MHz at a low latency timing of 9-9-9-27 at 1.65V.

The SPDs are programmed to JEDEC standard latency DDR3-

1333MHz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses

gold contact fingers and requires +1.5V. The JEDEC standard

electrical and mechanical specifications are as follows:

XMP (Extreme Memory Profiles). Total kit

SPECIFICATIONS

CL(IDD)

Row Cycle Time (tRCmin)

Refresh to Active/Refresh

Command Time (tRFCmin)

Row Active Time (tRASmin)

Power

UL Rating

Operating Temperature

Storage Temperature

FEATURES

• JEDEC standard 1.5V ± 0.075V Power Supply

• VDDQ = 1.5V ± 0.075V

• 667MHz fCK for 1333Mb/sec/pin

• 8 independent internal bank

• Programmable CAS Latency: 5,6,7,8,9,10

• Posted CAS

• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• Programmable CAS Write Latency(CWL) = 7(DDR3-1333)

• 8-bit pre-fetch

• Burst Length: 8 (Interleave without any limit, sequential with

• Bi-directional Differential Data Strobe

• Internal(self) calibration : Internal self calibration through ZQ

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C,

• Asynchronous Reset

• PCB : Height 1.180” (30.00mm), double sided component

starting address “000” only), 4 with tCCD = 4 which does not al-

low seamless read or write [either on the fly using A12 or MRS]

pin (RZQ : 240 ohm ± 1%)

3.9us at 85°C < TCASE ≤ 95°C

Document No. 4805566-001.B00

9 cycles

49.5ns (min.)

110ns

36ns (min.)

1.800 W (operating per module)

94 V - 0

0° C to 85° C

-55° C to +100° C

07/18/11

Continued >>

Page 1

Related parts for KHX1600C9D3K4/16GX

KHX1600C9D3K4/16GX Summary of contents

Page 1

... DDR3-1600MHz CL9 240-Pin DIMM Kit DESCRIPTION Kingston’s KHX1600C9D3K4/16GX is a kit of four 512M x 64-bit 4GB (4096MB) DDR3-1600MHz CL9 SDRAM (Syn- chronous DRAM) memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles) ...

Page 2

... MODULE DIMENSIONS: MODULE WITH HEAT SPREADER: FOR MORE INFORMATION WWW.KINGSTON.COM All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed ...

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