MAX9725CETC+T Maxim Integrated Products, MAX9725CETC+T Datasheet - Page 2
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MAX9725CETC+T
Manufacturer Part Number
MAX9725CETC+T
Description
IC AMP AUDIO .025W STER 12TQFN
Manufacturer
Maxim Integrated Products
Series
DirectDrive™r
Type
Class ABr
Datasheet
1.MAX9725CETCT.pdf
(17 pages)
Specifications of MAX9725CETC+T
Output Type
Headphones, 2-Channel (Stereo)
Max Output Power X Channels @ Load
25mW x 2 @ 16 Ohm
Voltage - Supply
900 mV ~ 1.8 V
Features
Depop, Short-Circuit Protection, Shutdown
Mounting Type
Surface Mount
Package / Case
12-TQFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MAX9725CETC+T
MAX9725CETC+TTR
MAX9725CETC+TTR
ABSOLUTE MAXIMUM RATINGS
SGND to PGND .....................................................-0.3V to +0.3V
V
V
C1P to PGND..............................................-0.3V to (V
C1N to PGND............................................(PV
V
OUTR, OUTL, INR, INL to SGND
OUTR, OUTL to SGND
INR, INL to SGND (MAX9725E)...................................-4V to +4V
1V, Low-Power, DirectDrive, Stereo Headphone
Amplifier with Shutdown
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS (MAX9725A–MAX9725D)
(V
wise noted. Typical values are at T
2
Supply Voltage Range
Quiescent Supply Current
Shutdown Current
Shutdown to Full Operation
SHDN Thresholds
SHDN Input Leakage Current
CHARGE PUMP
Oscillator Frequency
AMPLIFIERS
Voltage Gain
Gain Match
Total Output Offset Voltage
Input Resistance
Power-Supply Rejection Ratio
Output Power (Note 3)
DD
SS
SS
(MAX9725A–MAX9725D)..............(V
(MAX9725E) ..................................(V
DD
, PV
to PV
_______________________________________________________________________________________
to SGND or PGND ............................................-0.3V to +2V
= 1.5V, V
SS
SS
PARAMETER
to GND ....................................................+0.3V to -2V
...........................................................-0.3V to +0.3V
PGND
= V
SGND
= 0V, V
SYMBOL
A
I
= +25°C.) (See the Functional Diagrams. ) (Note 1)
PSRR
I
P
SHDN
f
V
LEAK
ΔA
V
t
I
V
OSC
R
V
A
ON
OUT
DD
SS
SS
SHDN
DD
OS
IH
IN
IL
V
V
- 0.3V) to (V
- 0.3V) to (V
= 1.5V, V
SS
Guaranteed by PSRR test
Both channels active
V
V
V
V
MAX9725A
MAX9725B
MAX9725C
MAX9725D
Input AC-coupled,
R
T
V
100mV
V
V
V
A
SHDN
DD
DD
DD
DD
DD
DD
DD
L
- 0.3V) to +0.3V
= 32Ω to GND,
= +25°C
= 0.9V to 1.8V
= 0.9V to 1.8V
= 0.9V to 1.8V (Note 2)
= 0.9V to 1.8V, T
= 1.5V
= 1.0V, R
= 0.9V, R
P-P
= 0V
DD
DD
DD
SS
ripple
+ 0.3V)
+ 0.3V)
+ 0.3V)
= V
L
L
PVSS
= 32Ω
= 32Ω
CONDITIONS
, C1 = C2 = 1µF, C
A
= +25°C
SHDN to SGND or PGND .........................................-0.3V to +4V
Output Short-Circuit Current ......................................Continuous
Continuous Power Dissipation (T
Junction Temperature ......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature (soldering) Reflow............................+230°C
Lead Temperature (soldering, 10s) .................................+300°C
MAX9725A/MAX9725D
MAX9725B
MAX9725C
f
f
R
R
IN
IN
12-Bump UCSP (derate 6.5mW/°C above +70°C)....518.8mW
12-Pin Thin QFN (derate 16.9mW/°C above +70°C) ..1349.1mW
L
L
T
T
= 1kHz
= 20kHz
= 32Ω
= 16Ω
A
A
= +25°C
= -40°C to +85°C
IN
= 1µF, R
L
= ∞, T
0.7 x V
-2.04
-1.53
-1.02
-4.08
MIN
493
0.9
15
60
10
A
A
= +70°C)
= T
DD
±0.45
MIN
-2.00
-1.00
-4.00
±0.5
±0.3
±0.6
TYP
-1.5
180
580
2.1
0.6
25
80
70
62
20
25
7
6
to T
0.3 x V
MAX,
±1.05
±1.58
-1.96
-1.47
-0.98
-3.92
MAX
±2.1
667
1.8
3.3
10
30
±1
35
DD
unless other-
UNITS
kHz
mW
mA
V/V
mV
µA
µA
kΩ
dB
µs
%
V
V