4-1734081-2 TE Connectivity, 4-1734081-2 Datasheet
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4-1734081-2
Specifications of 4-1734081-2
4-1734081-2 Summary of contents
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... B. Contact:Copper Alloy, Gold plating on contact area, Tin Plating on soldertail over Nickel underplating overall. C. Shield:Copper Alloy, Gold plating on contact area, Tin Plating on soldertail over Nickel underplating overall 3.3. RATINGS A. Voltage: 30 VAC rms. B. Current: 1.5 A Max C. Temperature : -40℃ to 80℃ DR Scott Chien ©2007 Tyco Electronics * Trademark Corporation │ Indicates change ...
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... PERFORMANCE REQUEIREMENT AND TEST DESCRIPTION The product shall be designed to meet the electrical, mechanical and environmental performance requirements specified in Figure 1. All tests shall be performed at ambient environmental conditions per TE specification 109-1 test requirements and procedure summary. 3.5. TEST REQUIREMENTS AND PROCEDURES SUMMARY ...
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... EIA-364-32C Mated Connector 25~65 (seven complete cycles) EIA-364-31B. Mated Connector 85 Subject mated connectors to 35+/-2 ℃ and 5+/-1% salt condition for 48hours. After test, rinse the sample with water and recondition the room temperature for 1 hour. EIA-364-26B. Figure 1(End) 108-57505 PROCEDURE -2 (30 ℃ ...
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... Resistance to Soldering Heat Thermal Shock Humidity Temperature Cycling Temperature Life Salt Spray NOTE: (a)Numbers indicate sequence in which tests are performed. (b)Discontinuities shall not take place in this test group, during tests. Rev B Test Group Test Sequence(a) Figure 2 108-57505 ...
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... Figure 3. Contact Resistance Measuring Point Figure 4. Resistance to reflow solder heat Rev B 108-57505 ...