DS90LV001TM/HAPB National Semiconductor, DS90LV001TM/HAPB Datasheet - Page 6
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DS90LV001TM/HAPB
Manufacturer Part Number
DS90LV001TM/HAPB
Description
Manufacturer
National Semiconductor
Datasheet
1.DS90LV001TMHAPB.pdf
(16 pages)
Specifications of DS90LV001TM/HAPB
Number Of Elements
1
Number Of Receivers
1
Number Of Drivers
1
Operating Supply Voltage (typ)
3.3V
Differential Input High Threshold Voltage
100mV
Diff. Input Low Threshold Volt
-100mV
Differential Output Voltage
450mV
Transmission Data Rate
800Mbps
Propagation Delay Time
2ns
Power Dissipation
726mW
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Package Type
SOIC N
Lead Free Status / Rohs Status
Not Compliant
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DS90LV001 Pin Descriptions (SOIC and LLP)
Typical Applications
Backplane Stub-Hider Application
Pin Name
OUT -
OUT+
GND
DAP
IN −
V
IN+
NC
EN
CC
Pin #
NA
1
2
3
4
5
6
7
8
Input/Output
NA
O
O
P
P
I
I
I
Ground
Inverting receiver LVDS input pin
Non-inverting receiver LVDS input pin
No Connect
Power Supply, 3.3V ± 0.3V.
Non-inverting driver LVDS output pin
Inverting driver LVDS output pin
Enable pin. When EN is LOW, the driver is disabled and the LVDS
outputs are in TRI-STATE. When EN is HIGH, the driver is enabled.
LVCMOS/LVTTL levels.
Die Attach Pad or DAP (LLP Package only). The DAP is NOT connected
to the device GND nor any other pin. It is still recommended to connect
the DAP to a GND plane of a PCB for enhenced heat dissipation.
6
Description
10133811