NCP2809BDMR2G ON Semiconductor, NCP2809BDMR2G Datasheet - Page 23

• Manufacturer Part Number: NCP2809BDMR2G
• Description: IC AMP STEREO AUD 135ME MICRO-10
• Manufacturer: ON Semiconductor
• Series: NOCAP™r
• Type: Class ABr

Specifications of NCP2809BDMR2G

• Output Type: Headphones, 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 135mW x 2 @ 16 Ohm
• Voltage - Supply: 2.2 V ~ 5.5 V
• Features: Depop, Short-Circuit and Thermal Protection, Shutdown
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NCP2809BDMR2G; NCP2809BDMR2GOSTR

−T−
0.038 (0.0015)
SEATING
PLANE
PIN 1 ID
G
K
−A−
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
H
10X
D
C
−B−
8 PL
0.041
1.04
0.08 (0.003)
8X
0.0196
PACKAGE DIMENSIONS
0.126
0.50
SOLDERING FOOTPRINT*
3.20
J
http://onsemi.com
M
CASE 846B−03
T
ISSUE D
Micro10
B
23
S
A
S
L
0.0126
SCALE 8:1
0.32
0.167
4.24
10X
0.208
5.28
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
4. DIMENSION “B” DOES NOT INCLUDE
5. 846B−01 OBSOLETE. NEW STANDARD
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
846B−02
DIM
G
A
B
C
D
H
J
K
L
MILLIMETERS
MIN
2.90
2.90
0.95
0.20
0.05
0.10
4.75
0.40
0.50 BSC
MAX
3.10
3.10
1.10
0.30
0.15
0.21
5.05
0.70
0.037
0.008
0.002
0.004
0.187
0.016
0.114
0.114
MIN
0.020 BSC
INCHES
0.122
0.122
0.043
0.012
0.006
0.008
0.199
0.028
MAX