MAX9724BETC+ Maxim Integrated Products, MAX9724BETC+ Datasheet - Page 14

• Manufacturer Part Number: MAX9724BETC+
• Description: IC AMP AUDIO .045W STER 12TQFN
• Manufacturer: Maxim Integrated Products
• Series: DirectDrive™r
• Type: Class ABr

Specifications of MAX9724BETC+

• Output Type: Headphones, 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 63mW x 2 @ 32 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Depop, Short-Circuit and Thermal Protection, Shutdown
• Mounting Type: Surface Mount
• Package / Case: 12-TQFN Exposed Pad
• Product: General Purpose Audio Amplifiers
• Output Power: 42 mW
• Thd Plus Noise: 0.02 %
• Supply Current: 3.5 mA
• Maximum Power Dissipation: 1333 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 16 Ohms
• Minimum Operating Temperature: - 40 C
• Amplifier Class: AB
• No. Of Channels: 2
• Supply Voltage Range: 2.7V To 5.5V
• Load Impedance: 16ohm
• Operating Temperature Range: -40°C To +85°C
• Amplifier Case Style: TQFN
• Rohs Compliant: Yes
• For Use With: MAX9724AEVKIT+ - EVALUATION KIT FOR MAX9724A/BMAX9724DEVKIT+ - KIT EVAL FOR MAX9724D
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

60mW, DirectDrive, Stereo Headphone Amplifier
with Low RF Susceptibility and Shutdown
To suppress this noise, and to provide a 2V
dard audio output level from a single 5V supply, the
MAX9724A can be configured as a line driver and
active lowpass filter. Figure 5 shows the MAX9724A
connected as 2-pole Rauch/multiple feedback filter with
a passband gain of 6dB and a -3dB (below passband)
cutoff frequency of approximately 27kHz (see Figure 6
for the Gain vs. Frequency plot).
Proper layout and grounding are essential for optimum
performance. Connect PGND and SGND together at a
single point on the PC Board. Connect PV
and bypass with a 1µF capacitor. Place the power-sup-
ply bypass capacitor and the charge-pump hold
capacitor as close to the MAX9724 as possible. Route
PGND and all traces that carry switching transients
away from SGND and the audio signal path. The thin
QFN package features an exposed paddle that
improves thermal efficiency. Ensure that the exposed
paddle is electrically isolated from PGND, SGND,
and V
when the board layout dictates that the exposed
paddle cannot be left floating.
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit
board techniques, bump-pad layout, and recommend-
ed reflow temperature profile, as well as the latest infor-
mation on reliability testing results, refer to the
Application Note UCSP—A Wafer-Level Chip-Scale
Package available on Maxim’s website at www.maxim-
ic.com/ucsp.
14
______________________________________________________________________________________
UCSP Applications Information
DD
. Connect the exposed paddle to SV
Layout and Grounding
SS
RMS
to SV
SS
stan-
only
SS
Figure 6. Frequency Response of Active Filter of Figure 4
-10
-15
-20
-25
-30
-35
10
-5
5
0
1k
MAX9724A ACTIVE FILTER GAIN
vs. FREQUENCY
10k
FREQUENCY (Hz)
100k
R
L
= 10kΩ
1M