CXA2550N Sony, CXA2550N Datasheet
CXA2550N
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CXA2550N Summary of contents
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... Absolute Maximum Ratings (Ta = 25°C) • Supply voltage V CC • Operating temperature Topr • Storage temperature Tstg • Allowable power dissipation P (SOP) D (SSOP) 370 Operating Conditions Supply voltage V – – 1 – CXA2550N 12 V –20 to +75 °C –65 to +150 °C 620 mW mW 3 E97514B25 ...
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Pin Description Pin Symbol I/O No — AGCVTH PD1 I 5 PD2 — EE Equivalent circuit 50µ 147 13.4k 10µ 10k 2 1k 20µ 8µ 55k 147 ...
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Pin Symbol I/O No — Equivalent circuit 12p 260k Inversion input pin for F and E I-V amplifiers. Connect these pins ...
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Pin Symbol I/O No FE_BIAS RFM Equivalent circuit 32k 164k 24p 174k 10µ 24p 174k 300µ 147 850 1m 147 15 60k 1m – ...
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Pin Symbol I/O No RFTC — AGCCONT LD_ON Equivalent circuit 147 15k 20µ 50µ 147 50µ 10µ 15µ 15µ 147 50k 7µ 50µ 147 ...
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Measure- amplifier RF amplifier FE amplifier – 6 – CXA2550M/N TE APC ...
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Measure- control level RF AGCCONT – 7 – CXA2550M/N ...
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CXA2550M/N ...
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Description of Functions RF Amplifier The photodiode current input to the input pins (PD1, PD2) are current-to-voltage (I-V) converted by the equivalent resistance of 58k at PD I-V amplifiers, respectively. The signal is added by the RF summing amplifier and ...
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Tracking Error Amplifier Each signal current from the photodiodes E and F is I-V converted and input to Pins 7 and 8 via a resistor which determines the gain. The signal is amplified by the gain amplifier, operated by the ...
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Center Voltage Generation Circuit This circuit provides the center potential when this IC is used at single power supply. The maximum current is approximately ±3mA. The output impedance is approximately 30k 30k V EE APC & ...
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... Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. GND R9 0.01µ ...
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LASER POWER CONTROL (LPC) The RF level is stabilized by attaching an offset to the APC V RF level fluctuations. The RF O and RF I levels are compared and the larger of the two is smoothed by the ...
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... Package Outline Unit: mm CXA2550M 20 1 0.45 ± 0.1 SONY CODE EIAJ CODE JEDEC CODE SCT Ass 0.45 ± 0.1 SONY CODE EIAJ CODE JEDEC CODE LEAD PLATING SPECIFICATIONS LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS 20PIN SOP (PLASTIC) 300mil + 0.4 12.45 – 0 0.1 1.27 0.2 – 0.05 ± 0.12 M PACKAGE STRUCTURE ...
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... Package Outline Unit: mm CXA2550N ∗6.5 ± 0 0˚ to 10˚ DETAIL A SONY CODE EIAJ CODE JEDEC CODE 20PIN SSOP (PLASTIC 0.65 0.13 M b=0.22 ± 0.03 0.1 0.1 DETAIL B : PALLADIUM NOTE: Dimension "∗" does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT ...