LP5900TLX-1.8 National Semiconductor, LP5900TLX-1.8 Datasheet

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LP5900TLX-1.8

Manufacturer Part Number
LP5900TLX-1.8
Description
Manufacturer
National Semiconductor
Datasheet

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© 2007 National Semiconductor Corporation
LP5900
Ultra Low Noise, 150 mA Linear Regulator for RF/Analog
Circuits Requires No Bypass Capacitor
General Description
The LP5900 is a linear regulator capable of supplying 150 mA
output current. Designed to meet the requirements of RF/
Analog circuits, the LP5900 device provides low noise, high
PSRR, low quiescent current, and low line transient response
figures. Using new innovative design techniques the LP5900
offers class-leading device noise performance without a noise
bypass capacitor.
The device is designed to work with 0.47 μF input and output
ceramic capacitors. (No Bypass Capacitor is required)
The device is available in micro SMD package and LLP pack-
age. For all other package options contact your local NSC
sales office.
This device is available with 1.5V,1.575V, 1.8V, 1.9V, 2.0V,
2.1V, 2.2V, 2.5V, 2.6V, 2.7V, 2.75V 2.8V, 2.85V 3.0V, and
3.3V outputs. Please contact your local sales office for any
other voltage options.
Features
Typical Application Circuit
Stable with 0.47 μF Ceramic Input and Output Capacitors
No Noise Bypass Capacitor Required
Logic Controlled Enable
Thermal-overload and short-circuit protection
−40°C to +125°C junction temperature range for operation
201441
Key Specifications
Package
Applications
4-Bump micro SMD
(lead free)
6 Pin LLP (SC-70 footprint)
Input voltage range
Output voltage range
Output current
Low output voltage noise
PSRR
Output voltage tolerance
Virtually zero I
Very low I
Start-up time
Low dropout
Cellular phones
PDA handsets
Wireless LAN devices
Q
(enabled)
Q
(disabled)
20144101
1.057 mm x 1.083 mm
2.2 mm x 2.5 mm
September 2007
75 dB at 1 kHz
www.national.com
2.5V to 5.5V
1.5V to 3.3V
80 mV typ.
6.5 μV
150 mA
150 μs
<1 μA
25 μA
± 2%
RMS

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LP5900TLX-1.8 Summary of contents

Page 1

... No Noise Bypass Capacitor Required ■ Logic Controlled Enable ■ Thermal-overload and short-circuit protection ■ −40°C to +125°C junction temperature range for operation Typical Application Circuit © 2007 National Semiconductor Corporation Key Specifications ■ Input voltage range ■ Output voltage range ■ Output current ■ ...

Page 2

Connection Diagrams The actual physical placement of the package marking will vary from part to part. Pin Descriptions Pin No. micro SMD LLP Pad www.national.com 4-Bump Thin micro SMD Package, Large Bump ...

Page 3

... LP5900SD-2.7/NOPB 2.8 LP5900SD-2.8/NOPB 3.0 LP5900SD-3.0/NOPB 3.3 LP5900SD-3.3/NOPB Supplied As 3k Units Tape and Reel LP5900TLX-1.5/NOPB LP5900TLX-1.575/NOPB LP5900TLX-1.8/NOPB LP5900TLX-1.9/NOPB LP5900TLX-2.0/NOPB LP5900TLX-2.1/NOPB LP5900TLX-2.2/NOPB LP5900TLX-2.5/NOPB LP5900TLX-2.6/NOPB LP5900TLX-2.7/NOPB LP5900TLX-2.75/NOPB LP5900TLX-2.8/NOPB LP5900TLX-2.85/NOPB LP5900TLX-3.0/NOPB LP5900TLX-3 ...

Page 4

... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. V Pin: Input Voltage IN V Pin: Output Voltage -0 OUT V Pin: Enable Input Voltage -0 Continuous Power Dissipation (Note 3) Junction Temperature (T ) JMAX ...

Page 5

Symbol Parameter Login Input Thresholds V Low Input Threshold ( High Input Threshold ( Input Current at V Pin EN EN (Note 14) Transient Characteristics ΔV Line Transient OUT (Note 15) Load Transient (Note ...

Page 6

Typical Performance Characteristics. + 1.0V 1.2V 1mA , T (NOM) EN OUT Output Noise Density Power Supply Rejection Ratio Ground Current vs V www.national.com Unless otherwise specified,C = 25ºC. A 20144157 20144159 I = 0mA IN, ...

Page 7

Ground Current 100mA IN, LOAD 20144153 Short Circuit Current 20144148 Line Transient 20144155 Ground Current vs Load Current Load Transient Enable Start-up Time 1mA 20144150 20144149 = 2.8V) OUT 20144144 www.national.com ...

Page 8

Enable Start-up Time 100mA Enable Start-up Time 100mA Application Hints POWER DISSIPATION AND DEVICE OPERATION The permissible power dissipation for any package is a mea- sure of the capability of the device ...

Page 9

... Electrical Characteristics section under V micro SMD MOUNTING The micro SMD package requires specific mounting tech- niques, which are detailed in National Semiconductor Appli- cation Note AN-1112. For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the micro SMD device ...

Page 10

Physical Dimensions www.national.com inches (millimeters) unless otherwise noted 4-Bump Thin micro SMD NS Package Number TLA04CDA The dimensions for X1, X2 and X3 are given as 1.065 mm ± 0.030 1.090 mm ± 0.030 mm ...

Page 11

Notes 11 www.national.com ...

Page 12

... National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other brand or product names may be trademarks or registered trademarks of their respective holders. ...

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