SSM2166S Analog Devices Inc, SSM2166S Datasheet - Page 2

IC PREAMP AUDIO MONO MIC 14SOIC

SSM2166S

Manufacturer Part Number
SSM2166S
Description
IC PREAMP AUDIO MONO MIC 14SOIC
Manufacturer
Analog Devices Inc
Datasheet

Specifications of SSM2166S

Rohs Status
RoHS non-compliant
Output Type
1-Channel (Mono)
Voltage - Supply
4.5 V ~ 5.5 V
Features
Microphone
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Max Output Power X Channels @ Load
-

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SSM2166
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram and Typical Speech Application ...... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Pin Configuration and Function Descriptions ............................. 5
Typical Performance Characteristics ............................................. 6
Theory of Operation ........................................................................ 8
REVISION HISTORY
7/08—Rev. C to Rev. D
Changes to Figure 4 through Figure 9 ........................................... 6
Changes to Figure 11 and Figure 12 ............................................... 7
Changes to Figure 19 ...................................................................... 10
Changes to Figure 26 ...................................................................... 13
Added Top Branding Revision Reflecting Die Replacement
Table ................................................................................................. 17
5/08—Rev. B to Rev. C
Updated Format .................................................................. Universal
Changes to Features Section and General Description
Section ................................................................................................ 1
Changes to Table 1 ............................................................................ 3
Changes to Table 2 ............................................................................ 4
Deleted TPC 3; Renumbered Sequentially .................................... 4
Changes to Table 4, Pin 8 Description Column ........................... 5
Changes to Figure 5, Figure 6, Figure 8, and Figure 9 ................. 6
Change to Figure 11 ......................................................................... 7
Changes to Signal Path Section ...................................................... 9
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Applications Information ............................................................ 8
Rev. D | Page 2 of 20
 
 
 
 
 
 
 
 
 
 
 
 
 
Evaluation Board ............................................................................ 13
Outline Dimensions ....................................................................... 17
Added Figure 19 ............................................................................. 10
Deleted Figure 14 and Figure 17 .................................................. 12
Deleted Other Versions Section ................................................... 13
Changes to Figure 26 ...................................................................... 13
Changes to Figure 27 ...................................................................... 14
Changes to Test Equipment Section ............................................ 15
Added Table 6 ................................................................................. 16
Added Table 7 ................................................................................. 16
Updated Outline Dimensions ....................................................... 17
Changes to Ordering Guide .......................................................... 17
3/03—Rev. A to Rev. B
Deleted PDIP Package ....................................................... Universal
Change to General Description ....................................................... 1
Changes to Thermal Characteristics ............................................... 2
Changes to Ordering Guide ............................................................. 2
Deleted 14-Lead PDIP, Outline Dimensions .............................. 15
Updated 14-Lead Narrow-Body SOIC, Outline Dimensions ... 15
Signal Path ......................................................................................8
Level Detector ................................................................................9
Control Circuitry ........................................................................ 10
Power-Down Feature ................................................................. 12
PCB Layout Considerations ...................................................... 12
Evaluation Board Examples ...................................................... 14
Evaluation Board Setup Procedure .......................................... 15
Test Equipment Setup ................................................................ 15
Setup Summary .......................................................................... 16
Ordering Guide .......................................................................... 17
 
 
 
 
 
 
 
 
 
 
 
 

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